Double-Sided Polishing Machine TDP-1200
The two-sided projector in the series uses an upper-disk-disk-enable design, air-scapable, with different plating pads and polishing fluids to allow for double-sided polishing of materials. Product characteristics: pressurization: air-scaping method; ratio valve precise control pressure; processing: double-sided process; process optimization: unique pedagogy-face control process; constant temperature control: optical disk temperature control system
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Overview
The two-sided projector in the series uses an upper-disk-disk-enable design, air-scapable, with different plating pads and polishing fluids to allow for double-sided polishing of materials. Product characteristics: pressurization: air-scaping method; ratio valve precise control pressure; processing: double-sided process; process optimization: unique pedagogy-face control process; constant temperature control: optical disk temperature control system
Specifications
| Parameter | Value |
|---|---|
| Spray pressure. | Max1000 kgf |
| Up and down CD size | OD1100 mm |
| Number of cruise ships | 6 units |
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Supplier Information
Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer.
Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.
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