Single-Sided Polishing Machine TSP-380
The equipment is a desktop-based, high-precision, single-sided polishing device, which is small in size and simple in operation, and which can be fitted with copper plates, tin dishes, glass plates, stainless steel plates, etc., and is suitable for polishing of various semiconductor materials.
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Overview
The equipment is a desktop-based, high-precision, single-sided polishing device, which is small in size and simple in operation, and which can be fitted with copper plates, tin dishes, glass plates, stainless steel plates, etc., and is suitable for polishing of various semiconductor materials.
Specifications
| Parameter | Value |
|---|---|
| Disk Disk Specification | OD380 mm |
| Number of heads polished | 2 units |
| - The way you're putting it. | Spraying head by code or vacuum |
Key Features
Pressure: Vacuum/swipe pressure drive: polishing head rotation & swing drive system Process optimization: polishing head face adjustable
Datasheet
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Supplier Information
Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer.
Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.
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