Single-Sided Polishing Machine TAP-600 Dual
This high-precision single-side polisher has two polishing platens and supports simultaneous four-axis processing. Polishing heads can be configured for different wafers. Vacuum suction holds the wafer, an airbag applies pressure, and the polishing head rotates and oscillates. Suitable for polishing different semiconductor materials, with capacity up to 8-inch wafers. Two platens and 4 polishing heads can operate simultaneously. Cleaning includes immersion ultrasonic cleaning and reverse water-flush self-cleaning of the heads.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Wafer Size | 8 in |
| Disk Disk Specification | OD630 mm |
| Number of CDs dropped | 2 units |
| Number of heads polished | 4 units |
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