Fully Automatic Polishing Machine TFP-2320 INDEX
The equipment is equipped with 3 polished positions, 8 polished heads, and is processed efficiently. It has a system for cooling and temperature monitoring of disks, which ensures constant temperature during the polishing process, achieves full automatic upper and lowers through the Casset and mechanical hands, wets into and out of the fully automated processing mode.
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Overview
The equipment is equipped with 3 polished positions, 8 polished heads, and is processed efficiently. It has a system for cooling and temperature monitoring of disks, which ensures constant temperature during the polishing process, achieves full automatic upper and lowers through the Casset and mechanical hands, wets into and out of the fully automated processing mode.
Specifications
| Parameter | Value |
|---|---|
| Disk Disk Specification | OD630 mm |
| Number of main axes polished | 3 units |
| Number of heads polished | 4 groups, 8 units |
Key Features
Pressure: airbag pressure, scale valve precise control pressure Crystal round humid: enter the card box, keep the crystal round wet, prevent dry marks, full automated system: wet into wet out of fully automated mode processing Enriched: 4 groups of 8 polished heads, 3 CDs
Datasheet
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Supplier Information
Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer.
Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.
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