Fully Automatic Single-Axis Thinning Machine IVG-2040

Fully Automatic Single-Axis Thinning Machine IVG-2040

Supplier
Tsd-semicon
Part Number
IVG-2040
Category
Semiconductor Manufacturing Equipment
Origin
China

The full-automatic one-axis thinner is applied to the exploration of 4-12 inches of crystals, with the configuration of the lower part of the machine's hand, and the integration of automatic pairing, cleaning, drying, and the configuration of automatic thickness measurement and compensation systems, which will allow for the full-automatic processing of the crystal box to the box, drying out, product characteristics: full-automatic systems: full-automatic upper-down and dry-out fully automated systems; full functionality: automatic thickness measurement multi-part recovery; overload waiting; compatibility: grinding of semiconductor materials of various types adapted to the 4-12 inches of crystal-defaulted

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Overview

The full-automatic one-axis thinner is applied to the exploration of 4-12 inches of crystals, with the configuration of the lower part of the machine's hand, and the integration of automatic pairing, cleaning, drying, and the configuration of automatic thickness measurement and compensation systems, which will allow for the full-automatic processing of the crystal box to the box, drying out, product characteristics: full-automatic systems: full-automatic upper-down and dry-out fully automated systems; full functionality: automatic thickness measurement multi-part recovery; overload waiting; compatibility: grinding of semiconductor materials of various types adapted to the 4-12 inches of crystal-defaulted

Specifications

ParameterValue
Max. round size8 in
Sandwheel SpecificationØ203(OD)mm
Sandwheel axle power6.0 kw

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Supplier Information

Ts
Tsd-semicon
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Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer. Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.

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Fully Automatic Single-Axis Thinning Machine IVG-2040
Tsd-semicon · Semiconductor Manufacturing Equipment
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