Fully Automatic Chemical Mechanical Polishing Machine TPC-2110
This equipment is a fully automated CMP polishing device for thin membrane (media layer) applications for flat-downs of products such as oxides, metals, STI, SOI, MEMS. The equipment is 6/8 inches of crystal round, which is multi-zonal airbag-pressure, and allows for nanoscale precision removal, with double-faced brushing, osmosis, wrench & N2 drying, and full automatic CMP processing, drying and drying.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Wafer Size | 6/8 inches |
| Number of CDs dropped | 1 units |
| Wafer airbag pressure. | 0-700 g/cm² |
| Disk diameter | OD530 mm |
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