Fully Automatic Thinning Machine TFG-2200
This fully automatic wafer-thinning machine has two spindles and three stations for grinding 6/8-inch wafers. High-precision spindles, robotic loading/unloading, automatic centering, transfer positioning, cleaning and drying provide fully automatic dry-in/dry-out operation. Automatic thickness measurement, multistage grinding and overload waiting deliver high processing precision. It grinds a range of semiconductor materials and supports 6/8-inch wafer thinning. Features include high-rigidity air-bearing spindles, a dual-axis grinding unit, three processing tables, and fully automatic loading, unloading and grinding.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Max. round size | 8 in |
| Sandwheel Specification | Ø203(OD)mm |
| Sandwheel axle power | 6 kw |
| Number of workstations | 3 units |
Datasheet
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