Fully Automatic Integrated Thinning and Polishing Machine TGP-3350
The equipment is designed for thinning and polishing of 8-12 inches of crystal round, all designed for main aeroplanes and gas suspension tables, with automatic thickness, integrated crystal round calibration, and full automatic upper and lower, dry and dry.
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Overview
The equipment is designed for thinning and polishing of 8-12 inches of crystal round, all designed for main aeroplanes and gas suspension tables, with automatic thickness, integrated crystal round calibration, and full automatic upper and lower, dry and dry.
Specifications
| Parameter | Value |
|---|---|
| Max. round size | 12 in |
| Reduce main axle power | 7.5 kw |
| Reduce the size of the main axis sand wheel | OD303 mm |
| Spraying heads. | OD450 mm |
Key Features
Full automated system: full automatic upper and lower, dry in-dry out Full functionality: automatic thickness measurement, integrated crystal round calibration, cleaning, drying, etc. Compatibility: thinning and polishing for 8-12 inch silicon crystal round Multiplication: all designed for air-flood main axis and air-voltage table
Datasheet
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Supplier Information
Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer.
Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.
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