Fully Automatic Integrated Thinning and Polishing Machine TGP-3350

Fully Automatic Integrated Thinning and Polishing Machine TGP-3350

Supplier
Tsd-semicon
Part Number
TGP-3350
Category
Semiconductor Manufacturing Equipment
Origin
China

The equipment is designed for thinning and polishing of 8-12 inches of crystal round, all designed for main aeroplanes and gas suspension tables, with automatic thickness, integrated crystal round calibration, and full automatic upper and lower, dry and dry.

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Overview

The equipment is designed for thinning and polishing of 8-12 inches of crystal round, all designed for main aeroplanes and gas suspension tables, with automatic thickness, integrated crystal round calibration, and full automatic upper and lower, dry and dry.

Specifications

ParameterValue
Max. round size12 in
Reduce main axle power7.5 kw
Reduce the size of the main axis sand wheelOD303 mm
Spraying heads.OD450 mm

Key Features

Full automated system: full automatic upper and lower, dry in-dry out Full functionality: automatic thickness measurement, integrated crystal round calibration, cleaning, drying, etc. Compatibility: thinning and polishing for 8-12 inch silicon crystal round Multiplication: all designed for air-flood main axis and air-voltage table

Datasheet

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Supplier Information

Ts
Tsd-semicon
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Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer. Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.

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Fully Automatic Integrated Thinning and Polishing Machine TGP-3350
Tsd-semicon · Semiconductor Manufacturing Equipment
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