EMC Strip Fully Automatic Thinning Machine TSG-200A
The equipment is a double-axis, double-working table, processed through a diamond sand wheel, with a preep-feed extraction of resin materials, with automatic thickness measurement, multi-part extraction, overload waiting, and full automatic up and down, and drying out.
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Overview
The equipment is a double-axis, double-working table, processed through a diamond sand wheel, with a preep-feed extraction of resin materials, with automatic thickness measurement, multi-part extraction, overload waiting, and full automatic up and down, and drying out.
Specifications
| Parameter | Value |
|---|---|
| Work Size | Max 300×100,Min 100×50 |
| Number of sand wheel axes | 2 units |
| Sandwheel axle power | 5 kw |
| Sandwheel Specification | OD180 mm |
Key Features
Full automated system: full automatic upper and lower, dry-dry out automatic mode Full functionality: automatic thickness measurement multi-phase recovery program Overload waiting processing: processing resin materials by Crep-feed through diamond sand wheel multiplication: double-axis, double-working table and support for 5 vacuum partitions
Datasheet
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Supplier Information
Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer.
Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.
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