Equipment overview: small-batch validation packaging for universities and research institutes. (1) Linear or rotational-body packaging of optoelectronic and semiconductor devices, covering rectangular packages 3mm~180mm, with limits 2mm-200mm, and round packages below φ100mm diameter. (2) Programmable welding force 5~30N with closed-loop control. (3) Vacuum heating and unloading accessories can be configured. Listed functions: startup automatically resets and checks all motion axes. Ovens and transition chambers on both sides accommodate packages and lids. Oven settings span ambient~200℃ with adjustable time and ramp rate; vacuum and nitrogen-fill baking modes have independently configurable durations/counts and can be combined. During baking the door locks automatically; after baking the glovebox connection opens automatically. Carriers, one tray stack, transfer from oven/transfer chamber to the capping glovebox, followed by automatic loading, unloading and capping. Other functions include precision sealing controls, product protection and program/permission settings. Legend: ✓ included, × absent, ◯ optional. Manual sealer PXFHJ-1 composition: frame ✓; glovebox ◯; gas purification ◯; transfer ×; pneumatics ✓; machine vision ×; operation ✓; control ✓; power supply ✓; oven ◯; closed-loop pressurization ✓. Configuration: imported well-known control system ✓; precision multiaxis motors ✓; Japanese electrode materials ✓; British MICHELL dew-point meter ◯; oxygen monitor ◯; Japanese Daishinku oil-free vacuum pump ◯; square/round baking chamber ◯; single-stack/multilevel heating ◯; manual oven door; vision positioning within ±3μm ×; Japanese SMC pneumatics ✓; Japanese/Taiwanese modules and rails ✓; igus cable carrier ✓. PXFHJ-1 process: lid-tray and package-tray loading/unloading manual; vacuum heating/unloading boxes manual; carriers/fixtures compatible; real-time electrode-pressure control automatic.
| Parameter | Value |
| Work Size [rectangle; manual welding machine PXFHJ-1] | 2-180 mm |
| Work Size [circular; manual welding machine PXFHJ-1] | ≤150 mm |
| Tray Size [Manual sealer PXFHJ-1] | Max. 180x150mm |
| Weld pressure. [Manual sealer PXFHJ-1] | 2 ~ 30 N (limit 50 N) |
| Move range up/ down [Manual sealer PXFHJ-1] | 40 mm |
| Interval between electrodes [Manual sealer PXFHJ-1] | 2-180 mm |
| Boarding Precision - XY [Manual sealer PXFHJ-1] | ± < 0.035 |
| Pumpboard Accuracy - Angle [Manual sealer PXFHJ-1] | ±1.0 ° |
| Weight [Manual sealer PXFHJ-1] | 50 kg |
| Device Size (mm) (L x W x H) [Manual sealer PXFHJ-1] | 600 mm × 500 mm × 500 mm |
| Welding power [Manual sealer PXFHJ-1] | High-frequency inverter power system,4000A capacity |
| Welding function [Manual sealer PXFHJ-1] | Welding, X, Y straight-side welding, round welding. |
| Weld speed [Manual sealer PXFHJ-1] | 0.1 ~20 mm/s truncable |
| XYZ Axis Process [Manual sealer PXFHJ-1] | X:200mm, 200mm, 25mm (margin 40mm) |
| But the thickness of the welded sheet [Manual sealer PXFHJ-1] | 0.1mm~0.2mm |
| Air-cover requirements [Meet GJB548B-2005; sample welding and leak testing; good rate of 99.5% and above; manual welding machine PXFHJ-1] | <5X10-9 |
| Show some temperature [99.999% nitrogen; manual welding machine PXFHJ-1] | Better than -40°C (using99.999% nitrogen) |
| Material [Manual sealer PXFHJ-1] | Metalized ceramics such as stainless steel, KOVAR, etc., nickel plating |
(c) Linear, linear array or rotating body sealing of products such as PV, semiconductor, MEMS, sensors, optical electrons, etc.
Broad application and high precision for linear,linear-array or rotary packages in optoelectronics,semiconductors,MEMS,sensors and related products. Sealing/welding covers rectangular packages3mm~180mm,with limits2mm-200mm,and round packages of diameter belowφ100mm. Programmable welding force5~30N,with independent programmable closed-loop force control.
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Beijing Autotech Electrical Equipment Co., Ltd. was established in 2009, located in Beijing Economic-Technological Development Area, with a business area of 2100 square meters. It is a high-tech enterprise integrating scientific research and development, production and manufacturing, marketing, and engineering services, with multiple patents and software copyrights. The company has been focusing on precision special equipment for semiconductors, optical communications, sensors, MEMS and other devices for many years, with customers in 5G communications, military, aerospace, marine, 3C electronics, medical and other industries.
In particular, it has unique core technologies for coaxial, linear, and linear array packaging in the back-end processes of TO-CAN devices, sensor devices, semiconductor integrated circuits, hybrid integrated circuits, crystal oscillators, surface acoustic wave filters, RF filters, power modules and other components, and has developed multiple series of high-precision, stable performance products with strong cost-effectiveness advantages.
Main products include: precision laser sealing machines, full series of cap sealing machines, full series of parallel seam sealing machines, opening machines, transfer machines, board insertion machines, etc.
Based on two core technologies: self-learning precise positioning algorithm based on artificial intelligence and neural networks, and sub-pixel intelligent recognition algorithm based on area array cameras, the company continuously innovates to strengthen its core competitiveness. It has the ability to provide optical communication TO device manufacturers with an entire production line with independent intellectual property rights, and can meet various customized needs of customers.
The company adheres to the business philosophy of "smart innovation, craftsmanship" and continuously innovates to create value for users.
The company consists of two core businesses:
1) Precision optical communication electronics and semiconductor device manufacturing special equipment business.
With a deep understanding of industry manufacturing processes, using intelligent opto-mechatronics integration technology and visual inspection technology, it specializes in providing intelligent, high-precision, stable, reliable, and cost-effective automation equipment for users in optical communication electronics, semiconductor devices and other industries;
2) Automation system integration business.
The company has a group of skilled and experienced electrical control design and assembly engineers, using standardized production processes, strict inspection standards, professional assembly tools and brand accessories to provide customers with high-quality complete electrical control cabinet design, customization, assembly, wiring, installation and other services.
The company's core technical capabilities are:
◆ Self-learning precise positioning algorithm based on artificial intelligence and neural networks
◆ Sub-pixel intelligent recognition algorithm based on area array cameras
At present, the company adheres to the development concept of technological innovation and continuously strengthens its core competitiveness.
Electrical control system design:
The company has a group of skilled and experienced mechanical and electrical control design and assembly engineers, able to provide users with integrated services of systematic and professional scheme design, assembly, and debugging.
Concept → Design → Optimization → Assembly → Debugging → Finalization