MIG-S2 is a small, highly compatible, and highly reliable MIPI interface image-gathering card. Design is simple, user-friendly, and supports image-gathering for most of the camera modules on the market. The system is well scalable, providing a stable test environment, for AI or autopilot algorithm development after the light drive, and for production of cable camera-quality. MIG-S2 is a small volume, high compatibility, and reliable vehicle camera-map MIPI interface-gathering card. Design is simple, user-friendly, and supports the collection of images for most of the camera modules on the market. The system is well-enabled, provides a stable test environment, for AI or autopilot algorithm development after light vehicle-loading, and for production camera-quality.
| Parameter | Value |
| Dimensions | 146x100x50(mm) |
| MIPI interface | CS1-2 D-PHY, 4 lanes at up to 2.5Gbps per lane, real-time ECC&CRC |
| Support video format | 8bit~16bit raw,YUV422 |
| Support for Ser/Des | GMSL1, GMSL2, FPD-LinkIII for T/Mxim/Rohm/Sony and V3Link Clarks Link |
| Input Interface | 2xFAKRA connector/MIPI interface |
| Output Interface | USB3.0 Type-B |
| Power Supply | 12V/5A straight-flow adapter |
| DPS - Power voltage | 1-20 V |
| DPS - Current Measurement | 0-2 A |
High compatibility: supports 500+ camera modules on Windows and Linux. USB3.0 provides transfer rates up to 5Gbps. Optional deserializer boards include Maxim/TI/ROHM/SONY. Plug-and-play operation suits R&D and production-line testing. Supports 1~20V power with current measurement. Applications include I²C camera control and link configuration; MTF analysis using SFR, ISO12233:2023+, a Tukey window, fifth-order nonlinear fitting and noise suppression; image processing with multiple demosaicing algorithms, color calibration, AWB, Blob analysis and pattern recognition; and validation of camera intrinsic/extrinsic calibration. Provides C/C++, C# and Python APIs. Real-time ECC&CRC support reliable transfer. Multiple Ser/Des interfaces and deserializer boards accommodate different applications and most available automotive-camera modules.
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Yanding, as a nationally recognized high-tech enterprise, has always been driven by technological innovation and deeply engaged in the fields of testing equipment and image quality.
The company is headquartered in Zhangjiang Qingpu Park, with its core office base located in Shanghai Zhangjiang Science City, an innovation highland. It has also established R&D and operation centers in Shenzhen, Beijing, and South Korea, building a global technology R&D and service network to efficiently respond to domestic and international customer needs.
For many years, Yanding has focused on technological breakthroughs in the field of image quality. Its main business covers the full-chain R&D, design, manufacturing, and sales of high-precision instruments, high-end mass production equipment, image analysis algorithms, and industrial software. Relying on more than ten years of deep accumulation in core technology fields such as ultra-complex hardware boards and platform-level industrial software, the company has formed full-stack self-research and delivery capabilities from high-precision optical instruments, image quality analysis and calibration algorithms, to motion control software, optical lenses, image acquisition boards, image test charts, and mass production testing equipment, providing customers with end-to-end solutions.
The founding team and core members bring together senior technical management talents from well-known domestic and overseas enterprises, with an average of over 20 years of frontline R&D and operation management experience, and a deep understanding of international cutting-edge technology paths and industry trends. The company has assembled an R&D team composed of talents from famous domestic and overseas universities, highly skilled and continuously pursuing innovation. As of the end of 2024, the company has more than 170 employees, with R&D and technical personnel accounting for over 60%, injecting strong momentum into continuous technological breakthroughs and global market expansion.