Continuous Dual-Chamber Sputtering Coating Machine
The high-precision dual-chamber sputtering coating machine is a continuous dual-chamber magnetron sputtering system developed by our company. It offers fast deposition, high production efficiency and high stability. The coating chamber remains under vacuum, providing consistent coating and stable film quality.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Vacuum limit | Under 1.0 × 10-4Pa |
| Air exhaust time [Atmospheric pressure ~3.0 × 10-3Pa] | 10min (atmosphere pressure ~3.0 × 10-3Pa) |
| Temperature control | 0-300 ℃ |
| Vacuum size [Customizable] | Φ1800×2100 (customizable) |
| Workboard Size | Φ1600×1400（H） |
| Project Drive Speed | 50-100 rpm |
| Area of membrane plating | 7 Square |
| Splash source | 4-to-8-bit + ICP |
| Ion Source | Anode Ion Source/PLASMA |
| High vacuum exhaust system | 6TMP+2TMP(DP) |
| Low vacuum exhaust system | 630 mechanical pump + 1200 Rt pump |
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Datasheet
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