Excimer Laser Lift-Off Systems LLO-308-100
The excimer laser lift-off system uses an excimer laser as the source. Homogenization and shaping produce an extremely uniform, high-energy-density line beam, suitable for lifting polyimide and other thin films from glass, sapphire, and other substrates with high yield. Ultraviolet excimer laser output has shallow absorption depth and causes little damage to flexible substrates. The system is mainly used in production and development of flexible displays and flexible electronics.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Laser Wavelength | 308nm |
| Laser Beam Size | 100mm×0.3mm |
| Maximum Laser Energy Density | 300 mJ/cm² |
| Beam Uniformity | >92% |
| Scan Step Accuracy | 5μm |
| Weight | 500Kg |
| Cooling Method | Water |
| External Form (L×W×H) | 1600mm×1600mm×1400mm |
Key Features
Datasheet
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