Laser Scribing Machine
The laser scriber expands, shapes, and focuses the beam to micrometer scale, then moves it across the material to melt and vaporize the surface, forming grooves of a specified depth. It is a key chip-resistor production system for laser scribing resistor substrates based on ceramics or flexible PCB. Front/back alignment overlap:＜±5μm. Scribe width:10-20µm(UV),20-50µm(IR).
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Overview
Specifications
| Parameter | Value |
|---|---|
| Product Specifications [HiPA Standard] | 01005-2512 |
| Scribing Depth [HiPA Standard] | 10μm ~ 500μm |
| Scribing Width [HiPA Standard] | 20μm ~ 50μm |
| Laser [HiPA Standard ；CW] | CW 200W |
| Laser [HiPA Standard ；MOPA] | MOPA 20W |
| Straightness [HiPA Standard] | 1μm/70mm |
| Perpendicularity [HiPA Standard] | 2μm/70mm |
| Scribing Width [Optional ; Depth 10μm～100μm] | Line Width below 30μm |
| Scribing Width [Optional ; Depth 100μm～500μm] | Linewidth 30μm～50μm |
| Laser [Optional ;CW] | CW Laser Scribing of Ceramics |
| Laser [Optional ;MOPA] | MOPA Laser Scanning of Ink |
Applications
Key Features
Datasheet
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