Thin-Film Laser Resistor Trimmer

Thin-Film Laser Resistor Trimmer

Supplier
Jptoe
Category
Optical Production Equipment
Origin
China

Thin-film laser resistor trimmer. A micrometer-scale laser spot scans the resistor surface, melting and vaporizing the resistive paste layer to form a groove of specified depth and change conductive cross-section or length. A precision measurement system measures resistance in real time and stops emission at the target, bringing an initially lower resistance into the required tolerance. A key system for chip thin-film resistor production, it trims ceramic-substrate chip thin-film resistors and thin-film hybrid circuits. Resistance range:0.1Ω-500MΩ. Trimming accuracy:±0.05/±0.1/±0.5/±1(%).

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Overview

Thin-film laser resistor trimmer. A micrometer-scale laser spot scans the resistor surface, melting and vaporizing the resistive paste layer to form a groove of specified depth and change conductive cross-section or length. A precision measurement system measures resistance in real time and stops emission at the target, bringing an initially lower resistance into the required tolerance. A key system for chip thin-film resistor production, it trims ceramic-substrate chip thin-film resistors and thin-film hybrid circuits. Resistance range:0.1Ω-500MΩ. Trimming accuracy:±0.05/±0.1/±0.5/±1(%).

Specifications

ParameterValue
Substrate Dimensions [Standard]5060 / 6070 / 8084
Product Specifications [Standard]01005-2512
Resistance Trimming Range [Standard]100mΩ~20mΩ
Resistance Trimming Accuracy [Standard]±0.05%、±0.1%、±1%
Number of Channels [Standard]15 Conventional Relay Boards,240 Channels
Laser Parameters [Standard ;IR;@23kHz]IR>30W@23kHz
Laser Parameters [Standard ;GR;@80kHz]GR>2W@80kHz
Laser Parameters [Standard ;UV;@80kHz]UV≥0.8W@80kHz
Galvanometer Scanning Range [Standard ;IR;@F125]IR: 12mm × 75mm@F125
Galvanometer Scanning Range [Standard ;GR;@F100]GR: 12mm × 60mm@F100
Galvanometer Scanning Range [Standard ;UV;@F103]UV: 12mm × 60mm@F103
Cutting Speed [Standard]1mm/s~ 600mm/s
Trim Cut Pattern [Standard]Single Cut, L-Cut, Double Cut, IL-Cut, Multiple Cuts (Serpentine), U-Cut, Overlapping Cuts, J-Cut
Linewidth [Standard ;IR;@F125]IR: 17μm~25μm@F125
Linewidth [Standard ;GR;@F100]GR: 8μm~12μm@F100
Linewidth [Standard ;UV;@F103]UV: 6μm~10μm@F103
Substrate Dimensions [Optional]Customized to Customer Workpiece Dimensions
Resistance Trimming Range [Optional]20mΩ~500mΩ
Resistance Trimming Accuracy [Optional]±0.05%、±0.1%、±1%
Number of Channels [Optional]Expandable to 15 Ultralow-Resistance Relay Boards,240 Channels
Laser Parameters [Optional ;IR;@F160]IR:30μm~50μm@F160
Galvanometer Scanning Range [Optional ;@F160]12mm × 100mm@F160
Cutting Speed [Optional]1mm/s~ 600mm/s
Linewidth [Optional ;IR;@F160]IR:30μm~50μm@F160

Applications

Infrared: knife-edge width 17~25μm; photograph of the substrate. Green light: knife-edge width 8~9μm. Ultraviolet: knife-edge width 7~8μm.

Key Features

Proprietary lasers: JPT designs cost-effective, long-life lasers with assured service, customizable to applications; optimal fibers, crystals and pumps are assembled and undergo 72H aging tests for reliable long-term use. Narrow trimming kerfs enable greater resistance-adjustment ratios: green/UV lasers reach minimum widths of 8um/6um versus about 17um for infrared, allowing more cuts within the same resistor size. Multiple cut types/algorithms support diverse thin-film resistor designs with high precision; custom algorithms can be developed for specific forms.

Datasheet

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Supplier Information

Shenzhen JPT Opto-electronics Co., Ltd. (Stock Code: 688025) is a national high-tech enterprise integrating R&D, production and sales of lasers, laser/optical intelligent equipment and fiber optic devices. Adhering to the 'Laser+' positioning, it deeply cultivates core laser technologies, deeply integrates AI to build an intelligent driving engine, continuously focuses on laser core modules and future optical connection solutions, and strives to create a 'Light+AI' integrated innovation ecosystem. Relying on its independent and controllable technology matrix, its strategic layout covers key core areas such as consumer electronics head customers, data centers, next-generation communication infrastructure, electric vehicle precision manufacturing, new energy lithium battery intelligent manufacturing, and information technology (AR/VR). Through fundamental technological innovation, it reshapes the value chain of the optoelectronics industry and provides full-scenario optical solutions for the intelligent era.

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