Thin-Film Laser Resistor Trimmer
Thin-film laser resistor trimmer. A micrometer-scale laser spot scans the resistor surface, melting and vaporizing the resistive paste layer to form a groove of specified depth and change conductive cross-section or length. A precision measurement system measures resistance in real time and stops emission at the target, bringing an initially lower resistance into the required tolerance. A key system for chip thin-film resistor production, it trims ceramic-substrate chip thin-film resistors and thin-film hybrid circuits. Resistance range:0.1Ω-500MΩ. Trimming accuracy:±0.05/±0.1/±0.5/±1(%).
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Overview
Thin-film laser resistor trimmer. A micrometer-scale laser spot scans the resistor surface, melting and vaporizing the resistive paste layer to form a groove of specified depth and change conductive cross-section or length. A precision measurement system measures resistance in real time and stops emission at the target, bringing an initially lower resistance into the required tolerance. A key system for chip thin-film resistor production, it trims ceramic-substrate chip thin-film resistors and thin-film hybrid circuits. Resistance range:0.1Ω-500MΩ. Trimming accuracy:±0.05/±0.1/±0.5/±1(%).
Specifications
| Parameter | Value |
|---|---|
| Substrate Dimensions [Standard] | 5060 / 6070 / 8084 |
| Product Specifications [Standard] | 01005-2512 |
| Resistance Trimming Range [Standard] | 100mΩ~20mΩ |
| Resistance Trimming Accuracy [Standard] | ±0.05%、±0.1%、±1% |
| Number of Channels [Standard] | 15 Conventional Relay Boards,240 Channels |
| Laser Parameters [Standard ;IR;@23kHz] | IR>30W@23kHz |
| Laser Parameters [Standard ;GR;@80kHz] | GR>2W@80kHz |
| Laser Parameters [Standard ;UV;@80kHz] | UV≥0.8W@80kHz |
| Galvanometer Scanning Range [Standard ;IR;@F125] | IR: 12mm × 75mm@F125 |
| Galvanometer Scanning Range [Standard ;GR;@F100] | GR: 12mm × 60mm@F100 |
| Galvanometer Scanning Range [Standard ;UV;@F103] | UV: 12mm × 60mm@F103 |
| Cutting Speed [Standard] | 1mm/s~ 600mm/s |
| Trim Cut Pattern [Standard] | Single Cut, L-Cut, Double Cut, IL-Cut, Multiple Cuts (Serpentine), U-Cut, Overlapping Cuts, J-Cut |
| Linewidth [Standard ;IR;@F125] | IR: 17μm~25μm@F125 |
| Linewidth [Standard ;GR;@F100] | GR: 8μm~12μm@F100 |
| Linewidth [Standard ;UV;@F103] | UV: 6μm~10μm@F103 |
| Substrate Dimensions [Optional] | Customized to Customer Workpiece Dimensions |
| Resistance Trimming Range [Optional] | 20mΩ~500mΩ |
| Resistance Trimming Accuracy [Optional] | ±0.05%、±0.1%、±1% |
| Number of Channels [Optional] | Expandable to 15 Ultralow-Resistance Relay Boards,240 Channels |
| Laser Parameters [Optional ;IR;@F160] | IR:30μm~50μm@F160 |
| Galvanometer Scanning Range [Optional ;@F160] | 12mm × 100mm@F160 |
| Cutting Speed [Optional] | 1mm/s~ 600mm/s |
| Linewidth [Optional ;IR;@F160] | IR:30μm~50μm@F160 |
Applications
Infrared: knife-edge width 17~25μm; photograph of the substrate. Green light: knife-edge width 8~9μm. Ultraviolet: knife-edge width 7~8μm.
Key Features
Proprietary lasers: JPT designs cost-effective, long-life lasers with assured service, customizable to applications; optimal fibers, crystals and pumps are assembled and undergo 72H aging tests for reliable long-term use. Narrow trimming kerfs enable greater resistance-adjustment ratios: green/UV lasers reach minimum widths of 8um/6um versus about 17um for infrared, allowing more cuts within the same resistor size. Multiple cut types/algorithms support diverse thin-film resistor designs with high precision; custom algorithms can be developed for specific forms.
Datasheet
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Supplier Information
Shenzhen JPT Opto-electronics Co., Ltd. (Stock Code: 688025) is a national high-tech enterprise integrating R&D, production and sales of lasers, laser/optical intelligent equipment and fiber optic devices. Adhering to the 'Laser+' positioning, it deeply cultivates core laser technologies, deeply integrates AI to build an intelligent driving engine, continuously focuses on laser core modules and future optical connection solutions, and strives to create a 'Light+AI' integrated innovation ecosystem. Relying on its independent and controllable technology matrix, its strategic layout covers key core areas such as consumer electronics head customers, data centers, next-generation communication infrastructure, electric vehicle precision manufacturing, new energy lithium battery intelligent manufacturing, and information technology (AR/VR). Through fundamental technological innovation, it reshapes the value chain of the optoelectronics industry and provides full-scenario optical solutions for the intelligent era.
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