Fully Automatic High-Precision Laser Marking Equipment
The fully automatic high-precision laser marking equipment combines JPT's independently developed laser, galvanometer system and optical focusing system for marking glass, resin and wafers. Precision laser processing has replaced the original process and become an indispensable step in wafer manufacturing.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Laser | UV Picosecond |
| Laser Power | 5W/10W |
| Cooling Method | Constant-Temperature Water Cooling |
| Beam quality M² | M² < 1.3 |
| Focusing Method | Scanning Galvanometer |
| Focused Spot | <10μm |
| Equipment Dimensions | 1710 mm (L) × 2200 mm (W) × 2200 mm (H) |
| Maximum Processing Speed | 1000mm/s |
| Maximum Processing Dimensions [Customizable] | 4-inch, 6-inch, 8-inch, 12-inch ( Customizable ) |
| Processing Accuracy | ± 20μm |
| UPH | 35-50pcs/H |
| Positioning Accuracy | ±5μm |
| Control Software | JPT |
Key Features
Datasheet
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Supplier Information
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