ZTOF-4424-10A-Z45
The ZTOF-4424-10A-Z45 is a highly integrated, compact single-point dTOF (direct Time of Flight) sensor. It integrates a VCSEL emitter, single-photon avalanche diode (SPAD) array, microlenses, TDC (Time Digital Converter), and MCU. dTOF technology and built-in sunlight-rejection and cover-contamination algorithms maintain measurement accuracy independently of target reflectance in varied environments, enabling precise ranging up to5m. The ZTOF-4424-10A-Z45 supports firmware updates through IIC, with modes and algorithms customizable to customer needs. An eye-safety control circuit meets Class I requirements. 1.Product Dimensions:the ZTOF-4424-10A-Z45 uses a12-pin LGA package measuring4.4mm (±0.05mm) x2.4mm (±0.05mm) x1.0mm (±0.075mm); unspecified tolerance is±0.05mm. 2.PCB Pad Dimensions:Figure11, PCB pads, top view. 3.Application Circuit:ZTOF-4424-10A-Z45 block diagram. Notes:1.The external AVDD capacitor should be as close as possible to the AVDDVCSEL and AVSSVCSEL pins. 2.HOST must always drive XSHUT; use a pull-up if host state is unknown. XSHUT requires HW standby mode without IIC communication. Soldering and Storage:1.Soldering Requirements:recommended reflow peak240ºC~260ºC, never exceeding260ºC. The source references a lead-free SMT profile and parameters:Figure13,recommended reflow profile;Table13,recommended oven-temperature test controls. Notes:1.Temperatures are measured at the package top. 2.Maximum reflow cycles:three. 2.Storage Instructions:ZTOF-4424-10A-Z45 is supplied in sealed moisture-barrier bags, with moisture sensitivity level3 (MSL3). Moisture absorbed during packaging can be released and evaporated during soldering, adversely affecting optical characteristics. Each device is baked before dry packing to minimize moisture. Sealed aluminized bags protect against ambient humidity during shipping and storage. Shelf Life:an unopened bag provides12 months from its marked date under the stated conditions:Shelf Life12 months;Ambient Temperature<40℃;Relative Humidity<90%. Beyond12 months, or if the humidity indicator shows excessive storage humidity, rebake the device. Floor Life:ZTOF-4424-10A-Z45 has MSL3 sensitivity, giving168 hours from bag opening under these conditions:Floor Life168 hours;Ambient Temperature<30℃;Relative Humidity<60%. Exceeding floor life or these conditions requires rebaking before reflow or dry packing. Baking:125±5℃ for8 hours;do not bake directly in carrier tape;avoid excessive vibration or impact that could seriously deform or damage packaging. IIC Communication:device address0x41, or0x82 when adding a1bit read/write bit to form8bit;maximum transfer speed1Mbits/s.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Dimensions | 4.4 mm × 2.4 mm × 1.0 mm |
| Detection distance | 2cm~5m |
| Detection Accuracy [Indoors] | ±3% |
| Frame Rate | Up to 50 |
| Operating Voltage | 3.3 V |
| Operating Current [1Hz] | 0.9 mA |
| Operating Current [30Hz] | 17 mA |
| Standby Power Consumption [HW Standby] | <10 μA |
| Wavelengths | 940 nm |
| FOI (Field of illumination) | 22 deg |
| FOV (Field of View) | 25 ° |
| Interface Count | 12 |
| Interface Type | IIC, Slave address: (0x41) |
| Operating Temperature | -20~70 ℃ |
| Storage Temperature | -40~85 ℃ |
| Laser Safety | LASER CLASS 1 (IEC 60825-1: 2014) |
| 3.3V Power Supply AVDD,AVDDVCSEL [Table3 Extreme Parameters;Ta=25℃] | min ：-0.5； max ：3.63 |
| Ground GND,GND2,GND3,GND4 [Table3 Extreme Parameters;Ta=25℃] | min ：0； max ：0 |
| Number IO XSHUT,SDA,SCL,GPIO1 [Table3 Extreme Parameters;Ta=25℃;1.8V Mode] | min ：-0.5； max ：1.98 |
| Number IO XSHUT,SDA,SCL,GPIO1 [Table3 Extreme Parameters;Ta=25℃;3.3V Mode] | min ：-0.5； max ：3.63 |
| 3.3V Power Supply AVDD,AVDDVCSEL [Table4 Recommended Operating Conditions] | min ：2.97； typical ：3.3； max ：3.63 |
| Operating Ambient Temperature [Table4 Recommended Operating Conditions] | min ：-20； typical ：25； max ：70 |
| Latch up immunity ISCR [Table5 ESD Performance;JEDEC78E] | ±100 mA |
| ESD HBM Model VESD,HBM [Table5 ESD Performance;JS-001-2017] | ±2000 V |
| ESD CDM Model VESD,CDM [Table5 ESD Performance;JS-002-2018] | ±500 V |
| Current Consumption [2.4 Current Consumption/Table6;HW STANDBY;Xshut Off] | max ：10 |
| Current Consumption [2.4 Current Consumption/Table6;SW STANDBY;Xshut On] | max ：20 |
| Average Power Consumption [2.4 Current Consumption/Table6;30Hz,Including VCSEL] | max ：56.1 |
| Ranging Time [3.1 Ranging Time;Indoors without Background Light;Maximum Test Distance5m;300k Illuminations] | typical ：32 |
| μP Operating Frequency [4.6 MCU Parameters/Table7;MCU Operates with Oscillator or PLL Clock] | typical ：5； max ：80 |
| PLL Frequency [4.6 MCU Parameters/Table7;Corresponds to5MHz Oscillator Clock] | typical ：80 |
| Minimum Temperature TSmin [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | min ：130； max ：150 |
| Maximum Temperature TSmax [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | min ：200； max ：200 |
| tS Time [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top;TSmin to TSmax] | min ：90–110； max ：60–120 |
| Temperature TL [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | min ：217； max ：217 |
| Time tL [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | min ：55–65； max ：55–65 |
| Heating Ramp Rate [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top;First Heating-Ramp Row in Source Table] | min ：+2； max ：+3 |
| Temperature Tp-10 [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | max ：250 |
| Time tp-10 [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | max ：10 |
| Heating Ramp Rate [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top;Second Heating-Ramp Row in Source Table] | max ：+3 |
| Peak Temperature Tp [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | min ：240； max ：260 max. |
| Time to Peak Temperature [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top] | min ：300； max ：300 |
| Cooling Ramp Rate [Table13 Recommended Oven-Temperature Test Controls;Temperature Measured at Package Top;Peak Temperature to TL] | min ：-4； max ：-6 |
| Maximum Reflow Cycles [Soldering Requirements;Table13 Note2] | 3 次 |
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