Plasma Ashing Equipment
An imported plasma line array (dual-line) generates a uniform plasma region of 150mm ×800mm, with plasma ashing uniformity better than 5%. Substrate scanning enables uniform ashing of 1400mm gratings. Under low-vacuum conditions, oxygen plasma can thin photoresist grating masks on large substrates by ashing, with a resist removal rate below 100nm/min and vertical etch-rate uniformity better than 10%. It can also rapidly strip resist from the entire substrate at a removal rate above 1000nm/min.
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