320 Long-Wave Gas Imaging Core Module
A modular board architecture combines core, interface/display and power boards, with different imaging-core board combinations available.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Resolution | 320*256 |
| Pixel Pitch | 30μm |
| Cooling Time | ≤6min |
| NETD [Typical] | ~20mk |
| Response Wavelength Band [Extendable wavelength band 7μm~10.7μm] | 10.3μm~10.7μm |
| Frame Rate | 50/100Hz |
| Image Orientation | Horizontal / Vertical / Diagonal Directions |
| Image Bit Depth | 16 bits |
| Image Algorithms | Nonuniformity Correction (NUC), Adaptive Dynamic Compression (AGC); In-House Noise-Reduction Algorithm, Digital Image Enhancement (DDE) |
| Analog Video | PAL or NTSC |
| Digital Video | 3G-SDI; CameraLink RAW/YUV Image-Data Output (Optional) |
| Data Interface | Gigabit Ethernet Port; USB3.0-C (Optional) |
| Communication Interface | RS422/Ethernet |
| Power Supply [DC] | 12~28V DC |
| Steady-State Power | 12W |
| Dimensions | 132mm*57mm*71mm |
| Weight | ≤750g |
| Operating Temperature | -40℃~+60℃ |
Applications
Key Features
Datasheet
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Supplier Information
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