AM-8000 Series White-Light Interferometer

The AM-8000 series combines high-precision measurement with efficient intelligent control, automatically finding, focusing on and leveling the workpiece with one button. XY measurement range reaches 300×300mm for multipoint mapping and aspheric K-value measurement. Compared with AM-7000, stage travel improves threefold, load capacity 2.5-fold, positioning accuracy by 50% and movement/stitching speed by 30%. Compatibility with more interferometric objectives supports broader use in semiconductors, precision optics, 3C and new energy for efficient micro/nanostructure and roughness measurement.

Measurement of roughness, microtopography, step height and flatness. Roughness applications: grinding marks; mica surface topography/roughness; tool flank and rake faces; lenses; stitched gear measurements; metal texture; roller surfaces; copper foil; implant roughness/topographic dimensions; gyroscope lenses; wafers; precision-polished surfaces; HUD glass; gears; laser-machined parts(topography/roughness); optical-module liquid-cooling plates(3D topography/roughness); PCR-tube inner walls; dentures(3D profile/roughness); supersmooth lenses;3D-printed metal samples and aspheric lenses. Height/height difference: OLED surface dimensions and photovoltaic gridline height. 3D topography: PCB dimensions; capacitor surfaces; scratches in phone cover glass; bumping; wafer surface etching and etching patterns; wafer dicing depth; masks; lens molds; compound-eye microlenses; cylindrical lenses; float-glass surfaces; optical flats(roughness); silicon-wafer surface pyramids; laser-line depth; metal gridlines; cylindrical-lens curvature radius; microfluidic and phone-switch topographic dimensions; asphere K values; nanoimprint, laser-machined and MEMS dimensions; fretting wear volume; plough-groove area; LIBS craters(topography, depth, volume, steps); microlens-array microtopography; diamond-wafer roughness/flatness/evenness; microfluidic-chip roughness and channel height/width; Fresnel-lens curvature radius and surface-figure PV. 3D dimensions: vehicle-lamp-array curvature radius. 2D dimensions: chips and glass-substrate TGV holes. Flatness: ceramic substrates and periscope optics. Step height: steps, chip heights, character depths, PCB gold fingers and blind holes, metal-part topography/steps, metal-shim steps/topography. 2D profiles: cylindrical-lens arrays, Fresnel-lens angles, spherical-mirror-array curvature radius and microlens curvature radius.

Maximum accuracy 0.03nm; autofocus; automatic leveling.