AM-7000 Series White-Light Interferometer

AM-7000 performs subnanometer measurements on the surfaces of precision components and materials, acquiring areal 3D surface topography. Dedicated software processes and analyzes the topography, with RMS repeatability reaching 0.002nm. A high-speed, large-travel nanopiezoelectric actuator provides a maximum scanning speed of 400um/s. A 3200Hz rate combined with the industry-first SST+GAT algorithm enables instantaneous acquisition of up to five million point-cloud points.

Measurement of roughness, microtopography, step height and flatness. Roughness applications: grinding marks; mica surface topography/roughness; tool flank and rake faces; lenses; stitched gear measurements; metal texture; roller surfaces; copper foil; implants and intraocular lenses(roughness/topographic dimensions); gyroscope lenses; wafers; phone cover glass; precision-polished surfaces; HUD glass; gears; laser-machined parts(topography/roughness); optical-module liquid-cooling plates(3D topography/roughness); PCR-tube inner walls; dentures(3D profile/roughness); supersmooth lenses;3D-printed metal samples and aspheric lenses. Height/height difference: OLED surface dimensions and photovoltaic gridline height. 3D topography: PCB dimensions; capacitor surfaces; scratches in phone cover glass; bumping; wafer surface etching and etching patterns; wafer dicing depth; masks; lens molds; compound-eye microlenses; cylindrical lenses; float-glass surfaces; optical flats(roughness); silicon-wafer surface pyramids; laser-line depth; metal gridlines; microfluidic, phone-switch, nanoimprint, laser-machined and MEMS topographic dimensions; fretting wear volume; plough-groove area; wafer depth/height difference/roughness; LIBS craters(topography, depth, volume, steps); microlens-array microtopography; perovskite-cell roughness/topography; diamond-wafer roughness/flatness/evenness; microfluidic-chip roughness and channel height/width; alloy-shim3D topography; Fresnel-lens curvature radius and surface-figure PV. 2D dimensions: chips and glass-substrate TGV-hole dimensions. Flatness: wafers, ceramic substrates and periscope optics. Thickness: perovskite coatings. Step height: steps, chip heights, character depths, PCB gold fingers and blind holes, metal-part topography/steps, metal-shim steps/topography. 2D profiles: cylindrical-lens arrays and Fresnel-lens angles. Defect analysis: lens scratches. Foreign-matter analysis: lenses.

Maximum accuracy 0.03nm; maximum scanning speed 400um/s; extensive measurement tools.