Elite Pro Series Automatic 3D Packaging Substrate Inspection Equipment

Elite Pro Series Automatic 3D Packaging Substrate Inspection Equipment

Supplier
Atometrics
Category
Packages
Origin
China
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Applications

Line width and spacing, blind holes, pads, solder-mask openings, solder-mask offset, dimples and roughness. Three-dimensional dimensions: post-etch line width, dimple measurement and solder-mask openings. Two-dimensional dimensions: blind-hole inspection.

Key Features

Ultrahigh measurement accuracy, ultrahigh inspection efficiency and an extensive range of measurement tools. Ultrafast scanning: vertical scanning is five times faster than conventional models. Fully automatic measurement: simple operation and easy online programming. Offline analysis: original data can be retrieved for specific secondary analyses. Offline editing: editing through ODB++ programs is optional. Extensive measurement functions are available.

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Supplier Information

At
Atometrics
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Banshi Intelligent Technology (Shenzhen) Co., Ltd., a national-level specialized and sophisticated "Little Giant" and high-tech enterprise, focuses on providing precision measuring instruments and semiconductor metrology equipment to global customers. Currently, Banshi Intelligent provides stable and reliable services to many well-known enterprises such as Huawei HiSilicon, CATL, II-VI, Accelink, Bozhon, Chinese Academy of Sciences, AT&S, Shennan Circuits, Kinwong, and Huatian Technology. With the mission of "Exploring the future of humanity with precision measurement" and the vision of "Becoming a leader in precision measurement", Banshi Intelligent will continue to innovate in the fields of precision measurement and semiconductor metrology, redefining the connotation of "Intelligent Manufacturing in China" with product technology, and contributing Banshi's strength to the rise of Chinese instruments. Atometrics · Detection with Heart A brand under Banshi Intelligent "Atometrics" has launched multiple high-precision measurement products such as white light interferometers, flash testers, ultra-depth-of-field microscopes, line laser sensors, point laser sensors, spectral confocal displacement sensors, line spectral displacement sensors, wafer 3D metrology, and packaging substrate 3D automatic inspection equipment. They have been widely used in semiconductors, aerospace, 3C electronics, 5G communications, new energy, biomedical and other fields. Providing customers with high-quality products and services is our unremitting pursuit. Our team of world's top scientists and experienced engineers is a key advantage to ensure customer success.

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