Precision laser processing system
Laser processing can be divided by interaction mechanism into thermal and photochemical processing. Thermal processing uses surface heating for welding, engraving/cutting, surface modification, marking, drilling and micromachining. Photochemical processing uses high-energy photons to initiate or control reactions, including deposition, stereolithography and engraving/etching. Noncontact operation with adjustable beam energy and speed supports metals and nonmetals, including hard, brittle and high-melting materials. Common uses are cutting, surface treatment, welding, marking and drilling. Surface processes include transformation hardening, deposition, alloying and remelting. Common research and industrial sources are continuous-wave semiconductor, CO2 and fiber lasers, and ns, ps and fs pulsed solid-state or fiber lasers. The company provides integrated automated processing and inspection solutions using semiconductor, solid-state (ns, ps, fs) or fiber (continuous or pulsed) sources with micro/nano motion controls achieving short-travel accuracy up to 5nm, long-travel accuracy up to 1μm and travel exceeding 1m.
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