Yb:YAG+Diamond
Our Yb:YAG+Diamond bonded crystal is formed by bonding Diamond to one end of Yb:YAG, improving overall Yb:YAG laser performance. Yb:YAG has a thermal-conduction coefficient of 0.14 W/cm/°K@25°C, while Diamond has a thermal conductivity of 1.465W/m/k (@100℃). Bonding them into Yb:YAG+Diamond reduces thermal effects and pump-induced thermal lensing and offers high slope efficiency, improved power, enhanced coherence and frequency-conversion capability. Crylink uses surface-activated bonding, a low-temperature or room-temperature technique characterized by surface cleaning and activation. Before bonding, bombarding the bonding surfaces with fast atoms or ion beams increases bond strength, enabling high-quality bonding among inorganic materials, metals and semiconductors. Compared with high-temperature thermal bonding, surface-activated bonding provides stronger interfacial bonding and better control of optical absorption loss and surface-figure changes. Thermal diffusion bonding leaves surface impurities trapped at the interface. Surface-activated bonding removes polishing residues, organic contamination and surface oxides, breaks chemical bonds and increases activation energy. The resulting Yb:YAG+Diamond crystals have high bond strength, low interfacial absorption loss, generally below 20ppm, and small surface-figure changes after bonding (<lamda/8). They are available as rods, slabs, waveguides or sandwich structures. Various end coatings can be provided, including AR/AR@1030nm on both faces. Yb:YAG+Diamond bonded crystals are widely used in holography, interferometry and optical storage, and in efficient, high-power diode-pumped solid-state lasers.
Overview
Specifications
| Parameter | Value |
|---|---|
| Structure [Materials:Diamond] | Rods/Slabs/Sandwich/Waveguide/ |
| End-face Configuration [Materials:Diamond] | Flat/Convex/Wedge |
| Side Configuration [Materials:Diamond] | Polish/Fine Ground |
| Coating available [Materials:Diamond / @1030nm] | AR@1030nm |
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