Ti:sapphire+sapphire
Our Ti:sapphire+sapphire bonded crystal is formed by bonding Sapphire to one end of Ti:sapphire, improving overall Ti:sapphire laser performance. Sapphire has a thermal conductivity of 25.12W/m/k (@100℃). Bonding the materials reduces thermal effects and pump-induced thermal lensing in Ti:sapphire, providing excellent output efficiency, narrow mode-locked pulse widths, a high damage threshold and good thermal conduction. It also improves beam quality, output efficiency at 800nm, output stability and laser service life. Crylink uses surface-activated bonding, a low-temperature or room-temperature technique characterized by surface cleaning and activation. Before bonding, bombarding the bonding surfaces with fast atoms or ion beams increases bond strength, enabling high-quality bonding among inorganic materials, metals and semiconductors. Compared with high-temperature thermal bonding, surface-activated bonding provides stronger interfacial bonding and better control of optical absorption loss and surface-figure changes. Thermal diffusion bonding leaves surface impurities trapped at the interface. Surface-activated bonding removes polishing residues, organic contamination and surface oxides, breaks chemical bonds and increases activation energy. The resulting Ti:sapphire+sapphire bonded crystals have high bond strength, low interfacial absorption loss, generally below 20ppm, and small surface-figure changes after bonding (<lamda/8). They are available as rods, slabs, waveguides or sandwich structures. Various coatings can be provided on the ends, such as AR@600-800nm&532nm on both faces. Ti:sapphire+sapphire bonded crystals are widely used in wavelength-tunable lasers.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Absorption coefficient [Materials：Ti:sapphire] | 0.6~6.5cm⁻¹ |
| Structure [Materials：Ti:sapphire / Structure；sapphire：Rods/Slabs/Sandwich/Waveguide/] | Rods/Slabs/Sandwich/Waveguide/ |
| Structure [Materials：sapphire / Structure；Ti:sapphire：Rods/Slabs/Sandwich/Waveguide/] | Rods/Slabs/Sandwich/Waveguide/ |
| End-face Configuration [Materials：Ti:sapphire / End-face Configuration；sapphire：Flat/Convex/Wedge] | Flat/Convex/Wedge |
| End-face Configuration [Materials：sapphire / End-face Configuration；Ti:sapphire：Flat/Convex/Wedge] | Flat/Convex/Wedge |
| Side Configuration [Materials：Ti:sapphire / Side Configuration；sapphire：Polish/Fine Ground] | Polish/Fine Ground |
| Side Configuration [Materials：sapphire / Side Configuration；Ti:sapphire：Polish/Fine Ground] | Polish/Fine Ground |
| Coating available [Materials：Ti:sapphire / Coating available；sapphire：AR@600-800nm&532nm / @600-800nm&532nm] | AR@600-800nm&532nm |
| Coating available [Materials：sapphire / Coating available；Ti:sapphire：AR@600-800nm&532nm / @600-800nm&532nm] | AR@600-800nm&532nm |
Key Features
Datasheet
Supplier Information
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