7x1 200um to 400um DCF
This 7×1 multi-mode fiber combiner is designed for high power fiber laser application. It combines 7 pump lasers into one double cladding output fiber. Fiber type can be customized.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Pump Operating Wavelength [room temperature; heat sink with good interface contact and active cooling required] | Min:800 nm；Max:1000 nm |
| Pump Fiber-Core Diameter [Refer to fiber codes; room temperature; heat sink with good interface contact and active cooling required] | Typ:200 μm；Max:220 μm |
| Pump Fiber-Cladding Diameter [Refer to fiber codes; room temperature; heat sink with good interface contact and active cooling required] | Typ:220 μm；Max:242 μm |
| Pump Fiber-Numerical Aperture [Refer to fiber codes; room temperature; heat sink with good interface contact and active cooling required] | 0.22 |
| Output Fiber [X=20,25,30,…etc.; Refer to fiber code; room temperature; heat sink with good interface contact and active cooling required] | X/400 DCF |
| Pump Efficiency [Tested by 915nm Pump; room temperature; heat sink with good interface contact and active cooling required] | Min:97 %；Typ:98 % |
| Fiber Length [Each port; room temperature; heat sink with good interface contact and active cooling required] | Min:1.0 m |
| Power Handling [Each port; room temperature; heat sink with good interface contact and active cooling required] | Typ:500 W；Max:1000 W |
| Operating Environment Temperature | Min:-5 ℃；Max:+70 ℃ |
| Operating Humidity [Not recommend in high humidity for long time] | Min:5 %RH；Max:95 %RH |
| Storage Temperature | Min:-20 ℃；Max:+70 ℃ |
| Package [Handling power is different with PKG] | C7 or H2 or H10 or H9 |
| Mechanical Dimension [Package C7] | 100 mm × 15 mm × 10 mm |
| Total Pump Power Handling [Package C7; room temperature; heat sink with good interface contact and active cooling required] | ≤2400W |
| Mechanical Dimension [Package H2] | 150 mm × 15 mm × 10 mm |
| Total Pump Power Handling [Package H2; room temperature; heat sink with good interface contact and active cooling required] | ≤4200W |
| Mechanical Dimension [Package H10] | 150 mm × 30 mm × 20 mm |
| Total Pump Power Handling [Package H10; room temperature; heat sink with good interface contact and active cooling required] | ≤6000W |
| Mechanical Dimension [Package H9] | 150 mm × 30 mm × 20 mm |
| Total Pump Power Handling [Package H9; room temperature; heat sink with good interface contact and active cooling required] | ≤9000W |
Applications
Datasheet
Supplier Information
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