Carborundum / Green Silicon Carbide
Sciyea-series abrasive powder mainly consists of silicon carbide, a superhard abrasive described as second only to diamond in hardness. Median particle size reaches 0.25 micrometers. It cuts and grinds crystals and materials such as optical glass, semiconductor quartz parts and precision ceramics.
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Overview
Sciyea-series abrasive powder mainly consists of silicon carbide, a superhard abrasive described as second only to diamond in hardness. Median particle size reaches 0.25 micrometers. It cuts and grinds crystals and materials such as optical glass, semiconductor quartz parts and precision ceramics.
Specifications
| Parameter | Value |
|---|---|
| Central particle size [Grit #240] | 58.6±3.0 μm |
| Central particle size [Particle size #700] | 17.9±1.3 |
| Central particle size [Grit #3000] | 4.00±0.50 |
| Central particle size [Grit #280] | 49.4±3.0 μm |
| Central particle size [Particle size #800] | 14.7±1.3 |
| Central particle size [Grit #4000] | 3.00±0.40 |
| Central particle size [Grit #320] | 41.4±2.5 μm |
| Central particle size [Particle size #1000] | 11.9±1.0 |
| Central particle size [Grit #6000] | 2.00±0.40 |
| Central particle size [Grit #360] | 36.1±2.0 μm |
| Central particle size [Particle size #1200] | 9.90±0.80 |
| Central particle size [Grit #8000] | 1.20±0.30 |
| Central particle size [Grit #400] | 30.9±2.0 μm |
| Central particle size [Particle size #1500] | 8.40±0.60 |
| Central particle size [Grit #10000] | 0.51~0.70 |
| Central particle size [Grit #500] | 26.4±2.0 μm |
| Central particle size [Particle size #2000] | 6.90±0.50 |
| Central particle size [Grit #20000] | 0.50※(2) |
| Central particle size [Grit #600] | 21.1±1.5 μm |
| Central particle size [Particle size #2500] | 5.60±0.50 |
| Central particle size [Grit #30000] | 0.32※(1.3) |
Applications
Sciyea grinding powders mainly contain silicon carbide, with hardness second only to diamond and center particle sizes down to 0.25 micrometers; crystal cutting/grinding, crystal cutting, and hard-metal grinding.
Key Features
Long service life and high wire-sawing efficiency; high hardness and uniform average particle size; various particle sizes selectable to customer requirements.
Datasheet
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Supplier Information
Shenzhen Chuanyan Technology Co., Ltd. mainly develops and manufactures micron/nano rare earth polishing powder, polishing slurry, grinding fluid, and polishing pads. The products are widely used in microelectronics, display industry, semiconductor substrates, optics, optoelectronics, lasers, infrared crystals, precision ceramics, precision metals and other industries. The company has established business cooperation relationships with many research institutes, companies and institutions engaged in surface technology treatment in the United States, Japan, South Korea, Taiwan and China, and can provide different products and technical support according to customer needs. The company's products are complete in variety, excellent in performance, and have reached the advanced level of the industry.
The company is committed to strict quality control, has passed ISO9000 and ISO14000 certification, and has a perfect after-sales service system to solve various related needs of customers. Since its establishment, the company has always followed the people-oriented principle, and is committed to building a family-happy enterprise, promoting the enterprise spirit of rigor, diligence, professionalism and integrity. Express respect to customers with high-quality products.
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