High/Low-Temperature Thermal Flow Instrument SM-65-5501P
Product introduction: The high/low-temperature thermal-stream instrument independently tests an individual component within a larger assembly for high/low-temperature cycling, thermal shock, failure analysis and other reliability assessments without affecting neighboring components. Temperature-change shock rates are faster than conventional thermal shock chambers. Applications include semiconductor chips, flash memory Flash/EMMCPCBs, ICs, MCMs, small modules, optical communications such as Transceiver and SFP module high/low-temperature testing, and other electronics. Product positioning: It provides a simulated space reproducing real environments for product inspection and R&D validation by aerospace, aviation, electronics, automotive and battery manufacturers, quality inspection institutes, research institutes, universities and other testing organizations. The chamber helps shorten development cycles and improve product quality and reliability.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Temperature Range | -65~220℃ |
| Temperature-Control Accuracy | ±1℃ |
| Temperature Change Rate (No Load) | -50℃~+150℃ heating in 10 seconds; +150℃~-50℃ cooling in 15 seconds |
| Airflow Output | 100~550 SLM |
| Outer box dimensions [Customizable] | 680*800*1050mm (customizable) |
| Calibration Method | Manual Calibration |
| Power supply | 220v/50HZ |
| Temperature Sensor | T-Type Thermocouple |
| Status Display | Temperature Setting and Real-Time Display |
Applications
Key Features
Datasheet
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