Silica Polishing Slurry SD-5000
Kelin'ao's new-generation water-based silica polishing slurry offers particle sizes of 90 to 110nm. Specialized silica production and formulation provide low-cost, high-removal-rate precision polishing on most materials. SD-5000 is designed for sapphire substrates, achieving roughness ≤0.2nm and an ultrasmooth surface without scratches under OM inspection. Slurries are also available for metals, crystals and ceramics, used with polishing cloths, pitch laps and metal laps.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Particle Size Distribution-D50 [Particle size ：90nm] | 70～80 |
| Particle Size Distribution-D50 [Particle size ：100nm] | 90～100 |
| Particle Size Distribution-D50 [Particle size ：110nm] | 100～110 |
| pH | 10～13 |
| Solids content | 35～40% |
| Silica Purity | 99+% |
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