MCI Series 2.5 ns Microchip Laser, 473 nm
The MCI series micro-lasers are based on passive Q solid lasers based on semiconductor pumps; they consist of 946 nm and 473 nm wavelengths. The series uses integrated semiconductor pump modules and laser crystal design; small and compact laser heads; easy to install; support internal and external triggers; single pulse energy stabilization; and light beam quality. High product performance indicators make it widely used in radar ranging, spectrometry markets
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Overview
The MCI series micro-lasers are based on passive Q solid lasers based on semiconductor pumps; they consist of 946 nm and 473 nm wavelengths. The series uses integrated semiconductor pump modules and laser crystal design; small and compact laser heads; easy to install; support internal and external triggers; single pulse energy stabilization; and light beam quality. High product performance indicators make it widely used in radar ranging, spectrometry markets
Specifications
| Parameter | Value |
|---|---|
| Repeat frequency | 1kHz |
| Average Power | 20mW |
| Output Energy | 20μJ |
| Pulse width | 2500ps |
| Power stability@8h | <3% |
| Beam Mode | TEM00 |
| Horizontal Full-Angle Divergence (1/e²) | 9 |
| Vertical Full-Angle Divergence (1/e²) | 9 |
| Distortion | >100:1 |
| Wavelength | 946nm |
| System usage | ≤15W |
| Power size | 180×102×180 |
| Laser Head Size | 45×33×120 |
Applications
Laser induction fluorescent; ultrasound; radar ranging; Laman spectroscopy
Key Features
Tight structure; high stability; high oscillation orientation stability; 1 kHz repeat frequency; beam mode TEM00
Datasheet
Product Datasheet
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Supplier Information
Beijing RealLight Technology Co., Ltd. was founded in 2010, and is a high-tech enterprise specializing in the independent R&D, production and sales of semiconductor lasers, microchip lasers, erbium glass lasers, high-power solid-state lasers, high-energy lamp-pumped lasers and supporting devices. The company has a strong engineering team with professional capabilities in laser design, chip packaging, device packaging, and system integration. It has successfully completed many sci-tech innovation projects and model equipment projects, and obtained a number of qualifications and patents. Its products are widely used in analytical instruments, biomedical, radar ranging, laser processing and other fields, and customized overall solutions are available.
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