PSN0270 3D Line-Laser Depth Camera
Industrial line-laser 3D camera for high-reflectivity inspection.
Specification Snapshot
Camera Weight
350g
Light
660nm
Resolution
1920
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Overview
The PSN0270 industrial line-laser 3D camera uses triangulation and structured-light algorithms to acquire object surface profiles. It resists welding arc light and spatter and maintains accurate, efficient, stable operation on bright, reflective materials and groove surfaces.
Specifications
| Parameter | Value |
|---|---|
| Camera Model | PSN0270 |
| Camera Dimensions | 100mm×59mm×34mm |
| Camera Weight | 350g |
| Light | 660nm |
| Recommended Working Distance | 140mm-270mm |
| Near Field of View | 57mm |
| Far Field of View | 110mm |
| Z-Axis Accuracy | 0.03-0.06mm |
| Resolution | 1920 |
| Acquisition Frame Rate | Up to 60fps |
| Scan Mode | Single-banded/continuous scanning |
| Trigger Mode | Soft/hard trigger |
| Point Cloud Format | PCD、PLY. TXT |
| Image Type | Greyscale Chart, Light Cloud Chart |
| Average Power Consumption | 5W |
| Minimum Power Input | 24V/1A |
| Cooling Flow Rate | 5-10L/min(0.2-0.3MPa) |
| Airflow Noise | Less than 70 dB (50 cm) |
Applications
Medical assistance; automotive manufacturing; intelligent welding; 3D reconstruction; logistics sorting; aerospace.
Key Features
Adjustable laser intensity for operation in sunlight; suitable for highly reflective groove surfaces; easily replaceable anti-spatter protective glass; PC-based processing; straightforward software operation with support for secondary development.
Datasheet
Product Datasheet
PDF
Supplier Information
Wuxi MVSTek Sensor Technology Co., Ltd. is located in Xishan Economic and Technological Development Zone, Wuxi, Jiangsu. Founded in July 2019, it is a high-tech company with MEMS chip and application module development as its core technology.
The founding team has been conducting MEMS chip-related research since 2008, and since 2013 has focused on MEMS micromirror chips and their application modules, products, and solutions.
The company has launched domestically produced high-performance, low-cost, miniaturized MEMS micromirror chips, structured light projection modules, and 3D depth cameras. Related products can be widely used in 3D payment, 3D machine vision, security, LiDAR, laser micro-projection, and optical communication. Currently, it has cooperated with several leading domestic industry application companies.
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