KLT-G1MF-OV8856 V1.0
OmniVision OV8856 MIPI Focal Length 800;
Specification Snapshot
Focal Length
2.93 mm
Model Group Dimensions
23.00 x 6.50 mm
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Overview
OmniVision OV8856 MIPI Focal Length 800; Model KLT-G1MF-OV8856 V1.0. Chip OV8856; Focal Length 2.93 mm; 2.0; 3264 x 2448; 75°; Optical Lens 1/4; Optical Lens Dimensions 6.5 x 6.5 x 4.62 mm; Dimensions 23.00 x 6.50 mm; Focal Length; MIPI
Specifications
| Parameter | Value |
|---|---|
| Focal Length | 2.93 mm |
| Iris | 2.0 |
| Pixels | 3264 x 2448 |
| Visual angle | 75° |
| Lens Type | 1/4 |
| Model Group Dimensions | 23.00 x 6.50 mm |
| Module Type | Focal Length |
| Match Connector | DF30FC-40DS-0.4V |
Applications
Factory Tour Contact Us 800 Focal Length + MIPI SmartSens SC8238 KLT-5AMPF-SC8238 V1.0 SONY IMX274 KLT-N6MF-IMX274 V1.0 OmniVision OS08A20 KLT-H3MF-OS08A20 V2.0 KLT-H3MF-OS08A20 V1.0 SONY IMX219 KLT-KX8-IMX219 V3.0 KLT-KX8-IMX219 V2.0 KLT-KX8-IMX219 V1.0 KLT-RP-IMX219 V3.0 OmniVision OV8856 KLT-U9MF-OV8856 V1.0 KLT-G2K-OV8856 V1.1 KLT-N5K-OV8856 V1.0 KLT-G1MF-OV8856 V1.0 KLT-N6K-OV8856 V2.1 OmniVision OV8865 KLT-G1MF-OV8865 V1.0 KLT-D1MF-OV8865 V1.0 Home >> Products >> 800 Focal Length + MIPI >> OmniVision OV8856 >> KLT-G1MF-OV8856 V1.0 OmniVision OV8856 MIPI Focal Length 800 Model. KLT-G1MF-OV8856 V1.0 Model KLT-G1MF-OV8856 V1.0 Chip OV8856 Focal Length 2.93 mm 2.0 3264 x 2448 75° Optical Lens 1/4 Optical Lens Dimensions 6.5 x 6.5 x 4.62 mm Dimensions 23.00 x 6.50 mm Focal Length MIPI DF30FC-40DS-0.4V KLT Camera Modules
Datasheet
Product Datasheet
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Supplier Information
Kai Lap Technologies Group Limited (KLT), established in 2009, is a next-generation technology-driven manufacturer specializing in R&D, design and production of audio and video products. With a 20,000 sq. ft. automated plant and 100 employees, the company has an annual output of 30 million cameras. KLT provides OEM, ODM design and contract manufacturing services, offering customized one-stop solutions from concept to mass production, including custom design, raw material management, electronic engineering, firmware/software development, product testing and packaging design. Its products are widely applied in various camera modules.
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