1099nm laser
Laser incision is a non-contact cutting technique;
Specification Snapshot
Spot Diameter
3±0.2mm
Power Stability
<0.3% @3hours, RMS
Laser Controller Dimensions
≤483mm x 422mm x 105mm
Laser Head Size
≤68.5mm x 278mm x 46mm; ≤520mm x 200mm x 95mm
Size of water cooler
≤58cm x 29cm x 52cm
Laser Head Weight
≤10kg; ≤15kg
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Overview
Laser incision is a non-contact cutting technique; semiconductor materials can be cut in a precise and efficient manner. Cyclical intangible lasers, which are launched with PreciLasers; high-quality intangibility has been achieved on multiple Cyclical materials. Infrared lasers with pulse lengths and wave shapes that can be edited; pulse width and frequency that can be continuously adjusted; precision processing of crystal circles
Specifications
| Parameter | Value |
|---|---|
| Pulse-widening range | 100-800ns( ) |
| Heavy frequency reconciliation range | 50-200kHz( ) |
| Spot Diameter | 3±0.2mm |
| Beam Quality | TEM00, M²<1.2 |
| Polarization | >20dB |
| Laser Controller Dimensions | ≤483mm x 422mm x 105mm |
| Laser Head Size | ≤68.5mm x 278mm x 46mm; ≤520mm x 200mm x 95mm |
| Size of water cooler | ≤58cm x 29cm x 52cm |
| Laser Controller Weight | ≤20kg |
| Water Chiller Weight | ≤25kg |
| laser controller | >2 |
| Communications | RS422 |
Applications
Wafer
Key Features
High power; beam-size editable; beam-quality excellent; pulse-wide; frequency-modifiable
Datasheet
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Supplier Information
Founded in late 2017, Shanghai PreciLasers Technology Co., Ltd. is a high-tech enterprise and Shanghai specialized and sophisticated enterprise. We focus on R&D and production of high-end fiber lasers, with application-oriented precision fiber lasers as our core competency. We mainly target markets such as quantum information, LiDAR, advanced industry, and medical aesthetics, providing precise wavelength, linewidth, pulse shape, etc. controlled high-end fiber lasers. Our products are used in cutting-edge quantum scientific research, including quantum precision measurement, quantum computers, LiDAR, laser sensing, semiconductor inspection and processing, and other high-end applications.
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