Extended Depth-of-Field Digital Microscope AH Series
Exclusively paired with 50+ lens groups, high-resolution telecentric lenses and five-axis linkage design, achieving 360° no-dead-angle HD observation. Exclusive innovative new depth-of-field stacking algorithm, faithfully reproducing microscopic images at 500X magnification. Paired with a 1/1.7-inch 12-megapixel CMOS image sensor, achieving ultra-high-resolution observation with 100% CMOS utilization, where all pixels are effective pixels — what you see is what you get.
Specification Snapshot
Magnification
500X
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Overview
Exclusively paired with 50+ lens groups, high-resolution telecentric lenses and five-axis linkage design, achieving 360° no-dead-angle HD observation. Exclusive innovative new depth-of-field stacking algorithm, faithfully reproducing microscopic images at 500X magnification. Paired with a 1/1.7-inch 12-megapixel CMOS image sensor, achieving ultra-high-resolution observation with 100% CMOS utilization, where all pixels are effective pixels — what you see is what you get.
Specifications
| Parameter | Value |
|---|---|
| Lens Group | 50+ groups |
| Magnification | 500X |
| Observation Viewing Angle | Five-axis simultaneous movement, 360° without blind spots |
Applications
Failure analysis, flaw/defect observation, material micro-analysis, 3D observation; application examples: failure analysis IGBT chip-bonding inspection ceramic substrate-failure analysis PCB components-cold solder/missing solder analysis capacitor-failure analysis PCB components-cold solder/missing solder solder joints-observation (black/white mode) metal-cross-section analysis; defect analysis chip package-gold plating observation diamond-particle size analysis connector-defect analysis connector-contact spring cracking defect analysis lens-scratch measurement spring-surface defect analysis needle-defect analysis hearing aid-rubber analysis cochlear implant-screen inspection probe-defect analysis lithium battery electrode-electrode burrs; micro measurement PCB-thickness measurement cutting tool-micro measurement TGV glass substrate-drilling measurement hair-diameter measurement TGV through hole-inner wall observation/foreign matter analysis stator coil winding-failure analysis/surface defects; surface analysis metallography-friction and wear analysis aluminum mold-surface analysis leather-surface analysis material-metal strength analysis cutting tool-cutting edge analysis drill bit tool-cutting edge analysis milling cutter-cutting edge analysis razor blade gear-surface analysis ink-print flatness analysis ink-surface dark spot analysis paper-fiber analysis material-scratch analysis metal processing-surface analysis; material analysis leather-anomaly analysis white fused alumina-anomaly analysis glass cover plate-edge chipping observation; foreign matter analysis lens-foreign matter measurement camera module-foreign matter analysis sealing ring-foreign matter analysis; biological observation insect-villi observation
Datasheet
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Supplier Information
Banshi Intelligent Technology (Shenzhen) Co., Ltd. (brand: Atometrics) was established in 2017, headquartered in Shenzhen. It is a national-level specialized and sophisticated 'Little Giant' enterprise and a high-tech enterprise, focusing on high-precision measuring instruments and semiconductor metrology and inspection equipment. The company has launched various high-precision measurement products such as white light interferometers, flash measuring instruments, super depth-of-field microscopes, laser sensors, spectral confocal sensors, wafer 3D metrology equipment, etc., which are widely used in semiconductors, aerospace, 3C electronics, 5G communication, new energy, biomedical and other fields. Major customers include Huawei HiSilicon, CATL, Chinese Academy of Sciences, and other well-known enterprises, committed to exploring the future of humanity with precision measurement.
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