wafer substrate series
Glass wafer substrates, with materials selectable from the Quartz series, Borofloat33 and Corning series, sizes Dia 4~12 inch (100mm~300mm), thickness tolerance better than ±0.003mm, total thickness variation TTV better than ±0.5μm, warpage/bow better than 0.010mm, surface quality better than 20-10; the development direction is ultra-thinning and large-area.
Specification Snapshot
Surface Quality
Better Than 20-10
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Overview
Glass wafer substrates, with materials selectable from the Quartz series, Borofloat33 and Corning series, sizes Dia 4~12 inch (100mm~300mm), thickness tolerance better than ±0.003mm, total thickness variation TTV better than ±0.5μm, warpage/bow better than 0.010mm, surface quality better than 20-10; the development direction is ultra-thinning and large-area.
Specifications
| Parameter | Value |
|---|---|
| Thickness Tolerance | Better Than±0.003mm |
| Total Thickness Variation (TTV) | Better Than±0.5μm |
| Warp/Bow | Better Than 0.010mm |
Applications
Advanced semiconductor packaging, display technology, optical communication devices, RF and power devices, MEMS devices
Datasheet
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Supplier Information
Shanghai Xuanfeng Optoelectronic Technology Co., Ltd., founded in August 2007, is a technology-oriented enterprise specializing in the processing of precision optical components, inorganic scintillation crystals, and transparent laser ceramic plates, committed to providing high-precision optical component design, manufacturing and customized services. The company relies on advanced production equipment, strict process control and rich industry experience, and its products are widely used in laser optics, security monitoring, medical equipment, industrial inspection, aerospace and other fields.
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