2.5Gbps 1490nm DFB TO
4-6 2.5Gbps 1490nm DFB TO Product Application PON Optical Communication TO-56 Package (4 ) 7.5mm Focal Length; Semiconductor Laser Chip, Device Module
Specification Snapshot
Storage Temperature
-40℃-85℃
Operating Temperature
-5-75℃
Current
100mA
Current
10mA
Current
10mA(25℃): 12mA(25℃)25mA(85℃)
Wavelength
1485 1490 1495nm
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Overview
4-6 2.5Gbps 1490nm DFB TO Product Application PON Optical Communication TO-56 Package (4 ) 7.5mm Focal Length; Semiconductor Laser Chip, Device Module. Product, Product, 2.5Gbps 1490nm DFBTO Laser Chip Optical Communication Application
Specifications
| Parameter | Value |
|---|---|
| Storage Temperature | -40℃-85℃ |
| Operating Temperature | -5-75℃ |
| Voltage | 2V |
| Current | 100mA |
| Current | 10mA |
| Current | 10mA(25℃): 12mA(25℃)25mA(85℃) |
| Wavelength | 1485 1490 1495nm |
| Current | 100nA |
| Current | 100uA: 1000uA |
| Delivery time | 4-8 weeks |
| slope efficiency | Minimum value 0.3mW/mA Maximum value 0.55mW/mA |
| side mode suppression ratio | Minimum value 35dB |
| Rise and fall time | 120ps |
| Forward Voltage | max:25V |
Key Features
4-6 2.5Gbps 1490nm DFB TO Product Application PON Optical Communication TO-56 Package (4 ) 7.5mm Focal Length; Semiconductor Laser Chip, Device Module. Product, Product, 2.5Gbps 1490nm DFBTO Laser Chip Optical Communication Application
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Supplier Information
Shenzhen Polycom Photonics Co., Ltd., founded in 2011, specializes in the R&D, production, and sales of semiconductor laser chips, devices, and modules for gas sensing, metrology, and fiber optic communications, focusing on semiconductor laser gas sensing solutions. It is one of China's largest suppliers of gas sensing laser devices. In 2018, it was recognized as a National High-Tech Enterprise, holding multiple patents, integrated circuit layout designs. Its products are widely used in toxic and hazardous gas detection, coal mine safety, power, chemical, petroleum, and military fields. It provides full-wavelength semiconductor lasers from 657nm to 2350nm, including chips, TO, OSA, butterfly-packaged lasers, and driver circuit modules, with customization available from 760-2330nm. It has strategic cooperation with Chongqing University, Shenzhen University, and Ireland's Eblana Photonics.
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