2.5Gbps 1270nm DFB Laser TO
5Gbps 1270nm DFB Laser TO Application GPON TO-56(4 ) Package 7.5mm Focal Length: 2-4: 10k; 2.5Gbps 1270nm DFB LaserTO Laser Chip Optical Communication Application
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Storage Temperature | -40℃-85℃ |
| Operating Temperature | -20-85℃ |
| Voltage | 2V |
| Current | 100mA |
| Current | 10mA(25℃): 30mA(85℃) |
| Wavelength | 1260 1270 1280 nm |
| Current | 100nA |
| Current | 150uA: 950uA |
| Chip | 250（±25）um |
| Chip | 220（±25）um |
| Chip Thickness | 110（±20）um |
| slope efficiency | Minimum value 0.35mW/mA |
| side mode suppression ratio | Minimum value 35dB |
| Forward Voltage | max:1.6V |
Key Features
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
Color router
Optical Networking
Najing
sensor
-
10Gbps 1270nm DFB TO
Optical Networking
Netopto
Storage Temperature: -40℃-85℃ Operating Temperature: -5-70℃ Voltage: 2V
Product: 10Gbps 1270nm DFB TO: 4-8 Product TO-56(4pins) Package 6.5mm Focal Length 2mm Product; Semiconductor Laser Chip, Device Module. Product Gas Detection, Application; Product, 10Gbps 1270nm DFBTO Laser Chip Optical Communication Application
-
2.5Gbps 1490nm DFB TO
Optical Networking
Netopto
Storage Temperature: -40℃-85℃ Operating Temperature: -5-75℃ Voltage: 2V
4-6 2.5Gbps 1490nm DFB TO Product Application PON Optical Communication TO-56 Package (4 ) 7.5mm Focal Length; Semiconductor Laser Chip, Device Module. Product, Product, 2.5Gbps 1490nm DFBTO Laser Chip Optical Communication Application
-
Energy Homogenizing Rectangular Core Laser Delivery Fiber
Optical Networking
Scitlion
The energy-homogenizing rectangular-core laser delivery fiber series has a step-index refractive index profile, with a low-hydroxyl silica core in square or rectangular shape, offering excellent transmission performance in the VIS-NIR band and meeting the requirements of high-power laser transmission. It can be used in laser transmission, laser welding, laser cutting, laser coupling and other fields.
Related Articles
Semiconductor laser diodes are essential light sources for industrial sensing, LiDAR and laser printing. Many engineers waste time picking mismatched models. We summarize 4 simple selection standards, plus a mature industrial product: HGLD-790TO5.6-ZSP-10mW from HAUCORE.
The accelerated construction of new‑generation power systems has brought revolutionary upgrades to power‑equipment maintenance workflows.
Raybowlaser, a professional manufacturer of high-power laser chips, has officially launched its upgraded new-generation 1470nm high-performance laser chip. Achieving groundbreaking progress in rated output power and wall-plug efficiency (WPE), this innovative laser chip delivers superior and reliable core light source solutions for medical cosmetology, industrial processing, agricultural applications and scientific research equipment.
Driven by the rapid upgrading of intelligent vehicles, optoelectronic sensing technologies represented by laser sensing and infrared thermal imaging have become core pillars for high-level autonomous driving and smart cockpit iteration. Leveraging automotive-grade optoelectronic R&D advantages, Pilot Technology Group launches the VITAL intelligent vehicle solution. By integrating high-power VCSEL laser chips and vehicle infrared night-vision thermal imagers, the system comprehensively enhances vehicle environmental perception and realizes safer, smarter and more comfortable driving experiences.
Loading...
Name
Phone
Organization
Use Case
Database Platform