50Gbps InGaAs PIN Photodiode Chip
The 50Gbps InGaAs PIN is a front-illuminated photodiode chip with a semi-insulating
Specification Snapshot
Active Diameter
Typ 16μm
Spectral Response Range
900~1700nm
Responsivity
Typ 0.6A/W
Dark Current
Typ 1nA
-3 dB Bandwidth
Min 28GHz
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Overview
The 50Gbps InGaAs PIN is a front-illuminated photodiode chip with a semi-insulating substrate, coplanar electrodes and a 16μm photosensitive area.
Specifications
| Parameter | Value |
|---|---|
| Active Diameter | Typ 16μm |
| Spectral Response Range | 900~1700nm |
| Breakdown Voltage | Min 25V; Typ 36V |
| Responsivity | Typ 0.6A/W |
| Dark Current | Typ 1nA |
| -3 dB Bandwidth | Min 28GHz |
Applications
1. 50Gbps optical communication transceivers 2. 50G Ethernet/SONET
Key Features
1. high bandwidth and low dark current 2. coplanar PN electrodes 3. High reliability
Datasheet
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Supplier Information
Wuhan Optics Valley Quantum Technology Co., Ltd. is a subsidiary of Xiandao Technology Group Co., Ltd. It is a technology-based enterprise focusing on high-end laser and detector chip products, integrating R&D, manufacturing and sales. Its business covers laser detection, high-speed optical communication, quantum secure communication and other fields. The company owns 35 independent intellectual property patents, and its expert team includes a winner of the Lifetime Achievement Medal of the European Academy of Sciences, selected candidates of national and provincial key talent programs, selected candidates of Wuhan "Huanghe Yingcai" talent program, and selected candidates of Wuhan East Lake New Technology Development Zone "3551" talent program.
The company has an advanced optical chip production line and chip packaging platform in Wuhan, with 3,000 square meters of class 1,000/100/10 clean workshops, equipped with more than 100 sets of advanced production and testing equipment; in addition, a 7,000 square meter new plant is under construction. The company has established a complete R&D, production and quality management system, obtained multiple patents, and its core technical team has rich experience in compound semiconductor technology development. Based on mature silicon-based, InP, and GaAs material system chip process platforms, it has successfully developed a number of products, committed to solving the bottleneck problem of long-term dependence on foreign imports for high-end chips, and providing downstream customers with high-quality full-series optical chip products and technical services.
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