Black Silicon Carbide Abrasive Grains
Black Silicon Carbide Abrasive Grains are sharp, angular black crystalline particles with a slight metallic luster, produced by smelting quartz sand and petroleum coke at high temperature in an electric resistance furnace. With a Mohs hardness of about 9.2, second only to diamond and boron carbide, and excellent cutting ability, thermal stability and chemical inertness, this material is widely used in the photonics and optics industry for grinding, lapping and polishing of optical glass, lenses, prisms, crystals and semiconductor wafers, as well as for manufacturing bonded and coated abrasive tools.
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Overview
Black Silicon Carbide Abrasive Grains are sharp, angular black crystalline particles with a slight metallic luster, produced by smelting quartz sand and petroleum coke at high temperature in an electric resistance furnace. With a Mohs hardness of about 9.2, second only to diamond and boron carbide, and excellent cutting ability, thermal stability and chemical inertness, this material is widely used in the photonics and optics industry for grinding, lapping and polishing of optical glass, lenses, prisms, crystals and semiconductor wafers, as well as for manufacturing bonded and coated abrasive tools.
Specifications
| Parameter | Value |
|---|---|
| SiC Content | ≥98.5% |
| Free Carbon (F.C) Content | ≤0.2% |
| Fe2O3 Content | ≤0.15% |
| Magnetic Material Content | ≤0.02% |
| Mohs Hardness | 9.2 |
| Knoop Hardness | 2500-2800kg/mm² |
| True Density | 3.20-3.25g/cm³ |
| Bulk Density | 1.20-1.60g/cm³ |
| Melting Point | ≥2600°C |
| Thermal Conductivity | 100-150W/(m·K) |
| Linear Expansion Coefficient | 4.0-5.0×10⁻⁶/K |
| Grit Size Range (Coarse Grinding) | F8-F220 |
| Grit Size Range (Fine Grinding & Polishing) | F230-F1200 |
| Color | Black |
| Crystal Structure | α-SiC (Hexagonal) |
| Grain Shape | Angular, sharp-edged |
Applications
1. Coarse and fine grinding of optical glass, lenses, prisms and mirrors 2. Lapping and polishing of optical crystals, sapphire substrates and semiconductor wafers 3. Precision processing of technical ceramics, quartz and hard alloys used in optoelectronic devices 4. Manufacturing of grinding wheels, cutting discs, abrasive papers and other bonded or coated abrasive tools 5. Sandblasting and surface treatment of optical and photonic components
Key Features
1. High hardness (Mohs 9.2), second only to diamond and boron carbide, ensuring strong cutting ability 2. Sharp angular grain morphology for fast material removal and high grinding efficiency 3. High chemical purity (SiC ≥98.5%) with low free carbon and Fe2O3 content 4. Excellent thermal stability and high thermal conductivity, suitable for high-speed grinding 5. Good chemical inertness and wear resistance for long service life 6. Wide and uniform grit size distribution from F8 to F1200 to cover coarse grinding to fine polishing
Datasheet
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Supplier Information
<p>Jiaxing Jingkong Electronics Co., Ltd. is located at No. 480, Jiangxian Road, Yuxin Town, Jiaxing City, Zhejiang Province, with a factory area of 11,000 square meters and 70 employees. It is a small technology enterprise focusing on the R&D, production and sales of quartz crystal oscillator sensors. JJK attaches great importance to accumulation, especially in the piezoelectric quartz crystal industry with over 30 years of practical experience. The company prioritizes employee stability in management and has built a highly stable operating team. By the end of 2022, JJK's direct user base had exceeded 800. JJK's unremitting goal is to provide customers with the most reliable crystal oscillator slices. The manufacturing process pursues high reliability even if it means technological overkill, without compromising reliability to reduce costs. To further meet customer needs, JJK continuously develops related new products, offering various cost-effective coating materials and crystal control accessories.</p>
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