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Photonics Source provides 48 products. Download datasheets, request quotes, and compare function, price, and availability.
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Unknown
Material: Stainless steel Outer Diameter: Unknown Inner Diameter: Unknown Thread Type: Unknown -
DO636
Device Dimensions: Standard Display Screen: Integrated touchscreen Operation Mode: Automated Power Requirements: Standard Safety Features: Emergency stop -
Unknown
Dimensions: Unknown Material: Unknown Wavelength Range: Unknown Response Time: Unknown Sensitivity: Unknown -
Precision Rotary Stage
Housing Material: Stainless steel Maximum Speed: 300rpm Maximum Load Capacity: 50kg Positioning Accuracy: ±0.01° Repeatability: ±0.005° -
Unknown
Material: Metal Thread Size: Unknown Diameter: Unknown Number of Holes: 4 -
Unknown
Diameter: Standard size (e.g., 4-inch, 6-inch, etc.) Material: Silicon or other optical-grade material Thickness: Varies based on application Surface Treatment: Polished or coated -
Unknown
Material: Unknown Dimensions: Unknown Wavelength Range: Unknown Reflectivity: Unknown Transmission: Unknown -
D1030 Precision Optical Device
Processing Accuracy: ±0.01mm Operating Voltage: 220V Power: 2kW Device Dimensions: 1200x800x1500mm Weight: 500kg -
Unknown
Material: 金属 and 光学材料 Dimensions: 标准尺寸 Surface Treatment: 高精度抛光 -
WB20 Ultrasonic Wire Bonding Machine
Operating Frequency: 60kHz Bonding Wire Diameter Range: 15-75μm Bonding Speed: 5000 bonds/hour Worktable Dimensions: 300mm x 300mm Microscope Magnification: 10x-100x -
TM21手动贴膜Equipment
Equipment Dimensions: 500x400x300mm Laminating Speed: ≤30m/min Power Requirements: 220V, 50Hz Weight: 25kg Applicable Film Width: ≤300mm -
S17 High-Precision Intelligent Sorting Equipment
Sorting Accuracy: ±0.01mm Sorting Speed: Up to 5000 units/hour Power Supply: AC220V, 50Hz Dimensions: 1200mm x 800mm x 1500mm Weight: 450kg -
扩晶Equipment
Equipment Dimensions: 600mm x 800mm x 1200mm Power Requirements: 220V, 50Hz Maximum Crystal Size: 200mm Operating Temperature Range: 0°C to 50°C Control System: Touchscreen interface with automated controls -
M18 Multi-Chip Intelligent Mounting Equipment
Mounting Accuracy: ±0.01mm Mounting Speed: Up to 10,000 UPH Supported Chip Size: 0.2mm x 0.2mm to 10mm x 10mm Equipment Dimensions: 1500mm x 1200mm x 1800mm Power Consumption: ≤5kW -
G19
Device Dimensions: 1200mm x 800mm x 1800mm Operating Voltage: 220V Power: 2kW Mounting Accuracy: ±0.01mm Maximum Mounting Speed: 5000 units/hour -
High-Precision Crystal Bonding Equipment
Equipment Dimensions: 1200mm x 800mm x 1800mm Operating Voltage: 220V Power: 2kW Bonding Accuracy: ±0.01mm Operating Temperature Range: 10°C-40°C -
A19 FC
Equipment Dimensions: 2000mm x 1500mm x 1800mm Weight: 1200kg Chip Size Range: 0.5mm x 0.5mm to 10mm x 10mm Bonding Accuracy: ±3μm Bonding Speed: Up to 5000 UPH -
Aging Mainframe
System Capacity: 3840PCS (≤1A) Single-layer Aging Unit: 10 layers Number of Drawers: 40 Number of Temperature Zones: 401 Device Dimensions: W*D*H: 1800*1400*2030mm -
PSS LDBI3072
Number of Test Channels: 0~250mA单板64路, 左右2 complete plans仓, 每层24 complete plans, 共3072路 Number of Independent Temperature Zones: 2 complete plans LD Drive Current: Level0:0~25mA, ±1%FS±0.1mA; Level1:0~250mA, ±1%FS±1mA(定制500mA) Current Mode: 恒流模式; 脉冲模式: 占空比0~3%, 脉宽200~1000us可调 LD Forward Voltage: 0~3V, ±1%FS±0.2V -
LRS-TEC-S121
Total Capacity: 单机容量512pcs Whole Machine: 支持防呆指插防止反插 Supported Components: T09/7056 Current Range: 0-9A 共阴极输出 Current Source Accuracy: 50mA