Semiconductor Packaging Equipment

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Photonics Source provides 7 products. Download datasheets, request quotes, and compare function, price, and availability.

  • TruLaser 8000 Coil Edition Semiconductor Packaging Equipment

    TruLaser 8000 Coil Edition

    Germany
    Manufacturer: Trumpf
    Scrap Disposal Efficiency: High Production Flexibility: Enhanced with conveyor belt Automated Unloading: Integrated robot and gripper system Continuous Straightening Process: Ensures high surface and component quality Footprint: Compact
  • TruLaser 8000 Coil Edition Semiconductor Packaging Equipment

    TruLaser 8000 Coil Edition

    Germany
    Manufacturer: Trumpf
    Scrap Disposal Efficiency: High Automated Unloading System: Fully integrated robot and gripper system Continuous Straightening Process: Ensures highest surface and component quality Productivity and Flexibility: Enhanced by TruLaser cutting system and conveyor belt
  • TruLaser 8000 Coil Edition Semiconductor Packaging Equipment

    TruLaser 8000 Coil Edition

    Germany
    Manufacturer: Trumpf
    Scrap Disposal Efficiency: High Automated Unloading System: Integrated robot and gripper system Continuous Straightening Process: Ensures highest surface and component quality Production Flexibility: Enhanced with conveyor belt system
  • TruLaser 8000 Coil Edition Semiconductor Packaging Equipment

    TruLaser 8000 Coil Edition

    Germany
    Manufacturer: Trumpf
    Scrap Disposal Efficiency: High Automated Unloading System: Fully integrated robot and gripper system Continuous Straightening Process: Ensures highest surface and component quality Productivity and Flexibility: Enhanced with TruLaser cutting system and conveyor belt
  • TruLaser 8000 Coil Edition Semiconductor Packaging Equipment

    TruLaser 8000 Coil Edition

    Germany
    Manufacturer: Trumpf
    Scrap Disposal Efficiency: High Automated Unloading System: Integrated robot and gripper system Continuous Straightening Process: Ensures highest surface and component quality Production Flexibility: Enhanced with TruLaser cutting system and conveyor belt Footprint: Compact design
  • TruLaser Center 7030 Semiconductor Packaging Equipment

    TruLaser Center 7030

    Germany
    Manufacturer: Trumpf
    Max Laser Output: 6000W, 12000W Wavelength: 1.03μm Nominal Working Range, X-axis: 3000mm Nominal Working Range, Y-axis: 1500mm Nominal Working Range, Z-axis: 120mm
  • TruLaser 5030 fiber Semiconductor Packaging Equipment

    TruLaser 5030 fiber

    Germany
    Manufacturer: Trumpf
    Laser power: 3000W, 4000W, 6000W Maximum Processing Speed: 140m/min Working Area Dimensions: 3000mm x 1500mm Positioning Accuracy: ±0.03mm Repeatability: ±0.02mm
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