HL-HM-09k40H-00-B — High-Speed UV Imaging TDI Digital Line-Scan Camera
The Linea HS-series HL-HM-09k40H-00-B uses Teledyne DALSA's industry-leading CMOS TDI technology and is described as one of the most advanced TDI cameras on the market. Back illumination greatly improves sensitivity, especially for UV and visible imaging. A new-generation CLHS interface provides up to 8.4 gigapixels per second through one active optical cable. It suits gene sequencing, digital pathology, fluorescence imaging and wafer inspection.
Specification Snapshot
Resolution
9216×(128+64)
Line Frequency
400/200×2
Sensor Type
CMOS
Pixel Size
5μm
Dynamic Range
70 dB
Data Interface
CameraLink HS,CX4 AOC
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Overview
The Linea HS-series HL-HM-09k40H-00-B uses Teledyne DALSA's industry-leading CMOS TDI technology and is described as one of the most advanced TDI cameras on the market. Back illumination greatly improves sensitivity, especially for UV and visible imaging. A new-generation CLHS interface provides up to 8.4 gigapixels per second through one active optical cable. It suits gene sequencing, digital pathology, fluorescence imaging and wafer inspection.
Specifications
| Parameter | Value |
|---|---|
| Resolution | 9216×(128+64) |
| Line Frequency | 400/200×2 |
| Sensor Type | CMOS |
| Pixel Size | 5μm |
| Spectrum | Monochrome |
| Optical Interface | M90 |
| Dynamic Range | 70 dB |
| Data Interface | CameraLink HS,CX4 AOC |
| Power Supply Requirements | 12 ~ 24 VDC |
| Power Consumption | <30 W |
| Operating Temperature | 0°C ~ +65°C |
| Mechanical Dimensions (W×H×L) | 97 mm × 140.5 mm × 78.6 mm |
| Weight | 1200 g |
Key Features
Back-Illuminated Light Source; High Resolution and High Speed; High-Sensitivity UV Imaging; Programmable Coefficient Sets; Flat-Field and Lens-Shading Correction; Long Optical Cable
Datasheet
Product Datasheet
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Supplier Information
Daheng Image is a leading provider of machine vision products and solutions in China, specializing in industrial cameras, frame grabbers, lenses, vision software, and image processing systems for applications in manufacturing, logistics, medical, and scientific research.
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