Pluggable Optical Interconnect Chip and Assembly
Glass Waveguides for Pluggable Silicon-Photonics/Fiber Links,Minimum20um Pitch at Chip End Raises Density,LC/MPO Plug at Other End.
Specification Snapshot
Independent Fiber Mating Assembly - Number of Channels [Customized on Request]
Customized on Request
Independent Fiber Mating Assembly - Insertion Loss (IL (Max))
<0.5 dB
MPO Fiber Mating Assembly - Number of Channels
2~16CH
MPO Fiber Mating Assembly - Insertion Loss (IL (Max))
<1.0 dB
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Overview
Glass Waveguides for Pluggable Silicon-Photonics/Fiber Links,Minimum20um Pitch at Chip End Raises Density,LC/MPO Plug at Other End.
Specifications
| Parameter | Value |
|---|---|
| Independent Fiber Mating Assembly - Number of Channels [Customized on Request] | Customized on Request |
| Independent Fiber Mating Assembly - Pitch on Silicon Photonic Chip Coupling Side [Customized on Request] | 20 to Any Pitch (Customized on Request) |
| Independent Fiber Mating Assembly - Insertion Loss (IL (Max)) | <0.5 dB |
| MPO Fiber Mating Assembly - Number of Channels | 2~16CH |
| MPO Fiber Mating Assembly - Pitch on Silicon Photonic Chip Coupling Side [Customized on Request] | 20 to Any Pitch (Customized on Request) |
| MPO Fiber Mating Assembly - MPO Mating-Side Pitch | 250um |
| MPO Fiber Mating Assembly - Insertion Loss (IL (Max)) | <1.0 dB |
Applications
Silicon Photonics Chip Coupling; Lithium Niobate Chip Coupling; Pluggable Coupling for Other High-Density Photonic Chips
Datasheet
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Supplier Information
Li-chip Technology (Li-chip) was founded in 2018, a national high-tech enterprise and specialized and sophisticated enterprise, the world's largest PLC splitter chip supplier. Headquartered in Shenzhen with over 200 employees and more than 8000 square meters of R&D and production area, it has R&D centers in Shanghai and a large production base in Ganzhou, Jiangxi. With two decades of technology accumulation, it has established a complete photonic chip development system from material to process, design to testing, with internationally leading technology. Main products include PLC splitter chips, fiber arrays, optical couplers, silicon photonic chips, RGB combining chips, optoelectronic hybrid systems, bio-chemical sensing chips, etc. Certified with ISO9001, ROHS, CE, and Tel certification.
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