Glass-Based Optoelectronic Hybrid Integrated Substrate Co-Packaged / EO-PCB

Glass-Based Optoelectronic Hybrid Integrated Substrate Co-Packaged / EO-PCB

Supplier
Lichip-tech
Category
Ceramic and Glass Components
Origin
China

Big-data development drives higher-rate, lower-cost optoelectronic integration, optical interconnects and optoelectronic hybrid PCB (OEPCB) concepts for next-generation technology. 砺芯科技 developed glass substrates with SIOW (Substrate Integrated Optical Waveguides). Integrated structures include splitters, WDM, optical cross-connects, coupling fan-outs and electrical through-vias. Optical devices such as silicon-photonics, lithium-niobate and InP chips, plus integrated circuits, mount on the substrate. This hybrid system offers low signal loss, high rate, low cost, high integration and volume-manufacturing suitability. The company is developing distinctive Hybrid SOOS (System On Optical Substrate) systems to provide leading technical solutions.

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Overview

Big-data development drives higher-rate, lower-cost optoelectronic integration, optical interconnects and optoelectronic hybrid PCB (OEPCB) concepts for next-generation technology. 砺芯科技 developed glass substrates with SIOW (Substrate Integrated Optical Waveguides). Integrated structures include splitters, WDM, optical cross-connects, coupling fan-outs and electrical through-vias. Optical devices such as silicon-photonics, lithium-niobate and InP chips, plus integrated circuits, mount on the substrate. This hybrid system offers low signal loss, high rate, low cost, high integration and volume-manufacturing suitability. The company is developing distinctive Hybrid SOOS (System On Optical Substrate) systems to provide leading technical solutions.

Applications

Silicon Photonics Coupling; Lithium Niobate Coupling; Optoelectronic Hybrid Integration

Key Features

High Density; High Reliability; Suitable for Mass Production

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Supplier Information

Li
Lichip-tech
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Li-chip Technology (Li-chip) was founded in 2018, a national high-tech enterprise and specialized and sophisticated enterprise, the world's largest PLC splitter chip supplier. Headquartered in Shenzhen with over 200 employees and more than 8000 square meters of R&D and production area, it has R&D centers in Shanghai and a large production base in Ganzhou, Jiangxi. With two decades of technology accumulation, it has established a complete photonic chip development system from material to process, design to testing, with internationally leading technology. Main products include PLC splitter chips, fiber arrays, optical couplers, silicon photonic chips, RGB combining chips, optoelectronic hybrid systems, bio-chemical sensing chips, etc. Certified with ISO9001, ROHS, CE, and Tel certification.

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Glass-Based Optoelectronic Hybrid Integrated Substrate Co-Packaged / EO-PCB
Lichip-tech · Ceramic and Glass Components
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