Glass-Based Optoelectronic Hybrid Integrated Substrate Co-Packaged / EO-PCB
Big-data development drives higher-rate, lower-cost optoelectronic integration, optical interconnects and optoelectronic hybrid PCB (OEPCB) concepts for next-generation technology. 砺芯科技 developed glass substrates with SIOW (Substrate Integrated Optical Waveguides). Integrated structures include splitters, WDM, optical cross-connects, coupling fan-outs and electrical through-vias. Optical devices such as silicon-photonics, lithium-niobate and InP chips, plus integrated circuits, mount on the substrate. This hybrid system offers low signal loss, high rate, low cost, high integration and volume-manufacturing suitability. The company is developing distinctive Hybrid SOOS (System On Optical Substrate) systems to provide leading technical solutions.
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Database Platform