Bestda RFG series RF power supplies

Bestda RFG series RF power supplies

Supplier
Csl-vacuum
Category
Semiconductor Packaging Equipment
Origin
China

An RF supply generates high-frequency alternating current to excite and control plasma. Power amplification and impedance matching efficiently transfer energy to a dynamically changing plasma load. A core high-end manufacturing device, it powers precision semiconductor etching, thin-film deposition, plasma cleaning, and related processes as an essential energy source in modern electronics.

Specification Snapshot
Dimensions [Configuration in this row: Operating frequency 40kHz; Power 200W 500W; Options within this power cell share cooling and dimensions, not independent models]
85mm (height) 442mm (width) 504mm (depth)
Dimensions [Configuration in this row: Operating frequency 400kHz; Power 200W 500W 1000W 1500W 2000W 3000W; Options within this power cell share cooling and dimensions, not independent models]
170mm (height) 234mm (width) 596mm (depth)
Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 1250W 2500W 3000W; Options within this power cell share cooling and dimensions, not independent models]
170mm (height) 234mm (width) 596mm (depth)
Response Time
<10 ms
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Overview

An RF supply generates high-frequency alternating current to excite and control plasma. Power amplification and impedance matching efficiently transfer energy to a dynamically changing plasma load. A core high-end manufacturing device, it powers precision semiconductor etching, thin-film deposition, plasma cleaning, and related processes as an essential energy source in modern electronics.

Specifications

ParameterValue
Operating Frequency [Configuration in this row: Operating frequency 40kHz; Power 200W 500W; Options within this power cell share cooling and dimensions, not independent models]40 kHz
Power [Configuration in this row: Operating frequency 40kHz; Power 200W 500W; Options within this power cell share cooling and dimensions, not independent models]200/500
Cooling Method [Configuration in this row: Operating frequency 40kHz; Power 200W 500W; Options within this power cell share cooling and dimensions, not independent models]Cold Air
Dimensions [Configuration in this row: Operating frequency 40kHz; Power 200W 500W; Options within this power cell share cooling and dimensions, not independent models]85mm (height) 442mm (width) 504mm (depth)
Communication Interface [Configuration in this row: Operating frequency 40kHz; Power 200W 500W; Options within this power cell share cooling and dimensions, not independent models]Analog; RS232/485
Communication Interface (Optional) [Configuration in this row: Operating frequency 40kHz; Power 200W 500W; Options within this power cell share cooling and dimensions, not independent models]DeviceNet; EtherCAT
Operating Frequency [Configuration in this row: Operating frequency 400kHz; Power 200W 500W 1000W 1500W 2000W 3000W; Options within this power cell share cooling and dimensions, not independent models]400 kHz
Power [Configuration in this row: Operating frequency 400kHz; Power 200W 500W 1000W 1500W 2000W 3000W; Options within this power cell share cooling and dimensions, not independent models]200/500/1000/1500/2000/3000
Cooling Method [Configuration in this row: Operating frequency 400kHz; Power 200W 500W 1000W 1500W 2000W 3000W; Options within this power cell share cooling and dimensions, not independent models]Air Cooling+Water Cooling
Dimensions [Configuration in this row: Operating frequency 400kHz; Power 200W 500W 1000W 1500W 2000W 3000W; Options within this power cell share cooling and dimensions, not independent models]170mm (height) 234mm (width) 596mm (depth)
Communication Interface [Configuration in this row: Operating frequency 400kHz; Power 200W 500W 1000W 1500W 2000W 3000W; Options within this power cell share cooling and dimensions, not independent models]Analog; RS232/485
Communication Interface (Optional) [Configuration in this row: Operating frequency 400kHz; Power 200W 500W 1000W 1500W 2000W 3000W; Options within this power cell share cooling and dimensions, not independent models]DeviceNet; EtherCAT
Operating Frequency [Configuration in this row: Operating frequency 13.56MHz; Power 1250W 2500W 3000W; Options within this power cell share cooling and dimensions, not independent models]13.56 MHz
Power [Configuration in this row: Operating frequency 13.56MHz; Power 1250W 2500W 3000W; Options within this power cell share cooling and dimensions, not independent models]1250/2500/3000
Cooling Method [Configuration in this row: Operating frequency 13.56MHz; Power 1250W 2500W 3000W; Options within this power cell share cooling and dimensions, not independent models]Air Cooling+Water Cooling
Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 1250W 2500W 3000W; Options within this power cell share cooling and dimensions, not independent models]170mm (height) 234mm (width) 596mm (depth)
Communication Interface [Configuration in this row: Operating frequency 13.56MHz; Power 1250W 2500W 3000W; Options within this power cell share cooling and dimensions, not independent models]Analog; RS232/485
Communication Interface (Optional) [Configuration in this row: Operating frequency 13.56MHz; Power 1250W 2500W 3000W; Options within this power cell share cooling and dimensions, not independent models]DeviceNet; EtherCAT
Frequency sweep matching time<100 ms
Response Time<10 ms
Pulse frequency range10Hz-10kHz

Applications

Semiconductors; photovoltaics; flat-panel displays; MEMS.

Key Features

Automatic sweep matching, CEX, and pulse functions; water or air cooling; sweep matching <100ms; response <10ms; pulse frequencies 10Hz-10kHz.

Datasheet

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Supplier Information

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Csl-vacuum
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Shenzhen CSL Vacuum Technology Co., Ltd. is a leading domestic supplier of core components for large-scale integrated circuit wafer front-end thin film deposition, plasma etching, lithography, photoresist stripping, ion implantation, and bonding equipment. The company is mainly engaged in the R&D, production, sales, and technical services of plasma RF power supply systems, plasma excitation devices, plasma DC power supplies, and various accessories. It also introduces core components related to vacuum acquisition and fluid control, providing overall solutions for core components around plasma processes. The company is a domestically technologically leading enterprise in plasma RF power supply systems that has achieved mass product delivery. Its products have been delivered in batches to leading domestic equipment manufacturers such as Piotech, AMEC, NAURA, Leadmicro, and ACM Research, and are also supplied to leading domestic wafer fabs. Founded in March 2013 and headquartered in Bao'an District, Shenzhen, the company has obtained ISO9001 and ISO14001 certifications. It is a national key "Little Giant" enterprise with specialized and sophisticated technologies, a national "Little Giant" enterprise, a council member of the China Integrated Circuit Component Innovation Alliance, a national high-tech enterprise, a "Kechuang China" RF switching power supply innovation base, a 2024 Guangdong Province Manufacturing Single Champion, and a Guangdong Province RF Switching Power Supply Engineering Technology Research Center. It has also won the 6th China Integrated Circuit Innovation Alliance "IC Innovation Award", the first prize of Guangdong Province Vacuum Science and Technology Progress Award, the "Core Component Innovation Award" of the 2024 "Bay Chip Award", SMIC's "Component Module Strategic Supplier", Piotech's "Outstanding Partner Award" and "Best Delivery Award", and Leadmicro's "Best Cooperation Award", among other honors. The company will continue to be committed to the R&D and production of core components for semiconductor equipment, providing customers with comprehensive integrated solutions, fulfilling social responsibilities, deeply cultivating the industry, demonstrating responsibility, and contributing to the high-quality development of the national integrated circuit equipment industry.

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Bestda RFG series RF power supplies
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