HAD1810 precision abrasive-wheel dicing machine

HAD1810 precision abrasive-wheel dicing machine

Supplier
Syhanway
Part Number
HAD1810
Category
Semiconductor Packaging Equipment
Origin
China
Specification Snapshot
Weight
580 Kg
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Specifications

ParameterValue
Larger workpiece dimension (φ) [Circular workpiece]φ8inch
Larger workpiece dimension (□) [Square workpiece]□205
Cutting depthMax 4 or custom
Spindle - Rotational-speed range3000-50000 r/min
Spindle - Output powerAC, 1.5 at 50000 (1.8, 2.4 DC optional)
X Axis-Travel345 mm
X axis - Speed-setting range0.1~400 mm/s
Y Axis-TravelMax 210
Y axis - Single-step accuracy≤0.003/5
Y axis - Accumulated error≤0.005/210
Z axis - Effective travel30 mm
Z Axis-Repeatability0.001 mm
θ axis - Drive methodDD motor
θ axis - Resolution1 ″
Automatic alignmentOptional
Non-contact height measurement [Model parameter table]Optional
Blade-breakage detectionOptional
Power SupplySingle-phase, AC220±10%
Volume WXDXH960 mm × 810 mm × 1700 mm
Weight580 Kg
Ambient Operating Temperature20~25℃
Operating-environment temperature fluctuationWithin ±1℃
Ambient Operating Humidity [Indoors; Non-condensing]<80%
Compressed-air dew point [Atmospheric pressure; Clean compressed air]-15℃ or below
Compressed-air residual oil content0.1ppm
Compressed-air filtration degree0.01um/99.5 or above
Cutting-water temperatureRoom temperature +2℃
Cutting-water temperature fluctuationWithin ±1℃
Cooling Water TemperatureSame as room temperature
Cooling-water temperature fluctuationWithin ±1℃
Installation-environment clearanceAvoid heavy impacts and external vibration; Do not install near blowers, ventilation outlets, high-temperature equipment or oily equipment
Installation floor and drainageWaterproof floor with unobstructed drainage

Applications

Precision dicing of 8-inch silicon wafers, ceramics, PCB, EMC, quartz, glass, gallium arsenide, lithium niobate, and other materials; ICs, gallium-arsenide LED chips, diodes, transistors, LED packaging, NTC, MEMS, IC, photovoltaics, medical devices, scintillation crystals, and related industries.

Key Features

1. Large effective processing size of 8 inches, with custom worktables and dicing frames. 2. Compact, space-saving design. 3. Easy operation through a new touchscreen GUI. 4. Imported spindles and other core components as standard, configurable to requirements. 5. High dicing accuracy and stable performance.

Datasheet

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Supplier Information

Sy
Syhanway
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Shenyang Hanway Technology Co., Ltd. is located at No. 19, Hunnan East Road, Hunnan New District, Shenyang City. It is a high-tech company mainly engaged in the R&D, sales, and service of semiconductor special equipment and accessories. With a technical team, product technology, and rich industry experience, it has a broad user base in various regions and provides reasonable and practical product solutions for customers. Hanway Technology focuses on the field of precision dicing and grinding of semiconductor materials. It produces HAD1600 series, HAD2600 series, HAD1800 series, and HAD3310 series precision dicing saws. Suitable for precision cutting of silicon, ceramics, PCB boards, EMC, quartz, glass, gallium arsenide, lithium niobate, and other materials, widely used in IC integrated circuits, discrete devices, LED packaging, optical communication devices, NTC, MEMS, photovoltaics, medical devices, scintillation crystals, and other industries. Customer demand is our work goal, and customer satisfaction is our direction! Shenyang Hanway Technology Co., Ltd. will continue to strive to provide customers with good equipment and perfect service. We will make unremitting efforts to enhance the development of the domestic semiconductor equipment industry and add color to the industry!

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HAD1810 precision abrasive-wheel dicing machine
Syhanway · Semiconductor Packaging Equipment
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