TGV/TSV atomic layer deposition ALD equipment for advanced packaging
This high-performance ALD coater is designed for advanced packaging technologies such as TGV (through-glass vias) and TSV (through-silicon vias). It precisely deposits functional layers such as titanium, copper and aluminum oxide on glass or silicon substrates, forming high-quality insulating and seed layers to meet stringent advanced-packaging requirements for reliability and microstructure precision.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Substrate dimensions | 50~300mm；200x200mm；φ300x400mm |
| Precursor | Different precursors configurable |
| Typical process | Al2O3, TiO2, SiO2, Ta2O5, HfO2, TiN, AIN, etc |
| Evacuation Time [8.0×10-2Pa] | 8.0×10-2Pa ≤25 minutes |
| Deposition temperature | 50~400C |
| Deposition rate | 8 s/cycle |
| Uniformity | ±1% |
Key Features
Datasheet
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