TGV / TCV deep-hole coating equipment HCINLINE-TGV/TCV
Uses load-lock sputtering technology with modular combinations of RF, DC, HiPIMS high-power impulse magnetron sputtering and pulsed bias. The loading/unloading chamber accommodates five substrate trays, with automatic lifting and substrate transfer for higher productivity. Multiple cathodes can sputter simultaneously for multilayer coatings, with automatic process handling and data logging. Widely used in electronic component research and production to deposit metal or resistive films on ceramics, glass and metals, achieving complete through-hole coverage. TGV aspect ratio up to 15:1; TCV hole diameter 20um and aspect ratio 20:1.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Cathode | Planar magnetron cathode/rotating cylindrical cathode |
| Power Supply | DC/DC pulse/MF/RF |
| Tray dimensions [Customizable] | L510xW515 (customizable) |
| Pumping system | Loading/unloading chamber: Roughing chamber: Roughing pump + turbomolecular pump; Coating chamber: Turbomolecular pump/cryopump |
| Heating System | Maximum 400°C |
| Uniformity | shi 1.2% (source wording) |
| Pressure holding | <0.1Pa |
| PVD copper thickness | Max.10um |
| Ultimate pressure | 3.0x10⁻⁵ Pa |
| Pump-down time [Down to 2.0 * 10⁻² Pa] | To 2.0 * 10⁻² Pa within 3min |
Applications
Key Features
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
Coated Component
Material-based Production Equipment
Fuzhouzhiyi
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 80T2500
Material-based Production Equipment
Auroralaser
Bending Capacity: 800 kN Bending Length: 2500 mm Distance Between Columns: 2000 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 110T2500
Material-based Production Equipment
Auroralaser
Bending Capacity: 1100 kN Bending Length: 2500 mm Distance Between Columns: 2000 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 110T4100
Material-based Production Equipment
Auroralaser
Bending Capacity: 1100 kN Bending Length: 4100 mm Distance Between Columns: 3500 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Wafer Bonding
Material-based Production Equipment
Jmwafer
晶沐光电 combines wafer grinding/polishing/thinning and laser processing to provide homogeneous/heterogeneous, permanent/temporary wafer bonding. High vacuum sealing, heat/pressure and surface activation create reliable interfaces for3D integration, advanced packaging, MEMS, power, RF and optoelectronic devices, including custom small batches for institutes. Referenced processes/equipment include single-wafer cleaning, class100 cleanroom bonding and KSB-H1000. Permanent bonding irreversibly joins wafers/chips into strong, hermetic, reliable structures. Direct bonding uses ultracleaning, plasma activation and CMP, room-temperature van der Waals prebonding and annealed Si-O-Si covalent bonds: no interlayer, high strength/hermeticity/insulation, void-free/low-stress interfaces for Si/Si, Si/SiO2 and Si/SOI. Anodic bonding uses heat/high electric field for silicon–glass chemical bonds, near-bulk strength, low leak rate and stable sealed cavities, such as Si/borosilicate. Eutectic bonding melts/diffuses Au-Sn, Cu-Sn, In or Au-Si interlayers, yielding low-temperature, conductive, thermally conductive, reliable bonds with broad process windows for Cu/Au/Sn-coated wafers. Thermocompression uses heat/precise pressure for solder-free metal-atom diffusion, high interconnect density/low interface resistance, and direct bonding of Si, metal-coated, compound-semiconductor, sapphire, glass, SiC or ceramic wafers. Hybrid bonding simultaneously joins copper/dielectric for integrated mechanical/electrical submicron-pitch connections, high bandwidth, low latency/loss and HBM/AI stacking in3D NAND, HBM, AI processors, high-end Chiplets and VLSI wafers. Examples are sapphire/Si, SiO2/sapphire and GaAs/Si. Temporary bonding glues a wafer/chip to a carrier for backside processing then gentle release. Thermal-slide bonding softens thermoplastics, PPC or polyimides with heat, hardens on cooling and reheats/slides for release; it resists heat/chemicals for Si thinning, TSV and advanced packaging, but needs heating and may leave adhesive. UV release cures for strength then shortwave UV degrades/debonds UV-release adhesive/double-sided tape: gentle room-temperature release for heat-sensitive MEMS, CIS, compound and ultrathin wafers, but needs a transparent carrier and has moderate heat resistance. Laser release uses transparent carriers and an absorbing layer to decompose/release adhesive without contact; laser-responsive coating plus bonding adhesive gives stress-free, residue-free, precise release for large ultrathin3D IC/HBM/Chiplet/advanced-packaging wafers, at high equipment/material cost. Low-melting In, SnBi or AuSn alloys bond molten and remelt for release; high heat tolerance/conductivity and acid/alkali resistance suit SiC/GaN power devices/high-temperature processes, but metal residue is difficult to clean and processing is complex. Bondable materials include Si, SiC, GaN, sapphire, GaAs, InP, quartz/borosilicate glass, alumina/aluminum-nitride ceramics, diamond, bonded composites, SOI, lithium tantalate/niobate and coated wafers.
Related Articles
VCSEL, short for Vertical Cavity Surface Emitting Laser, is a widely used semiconductor laser component in modern optoelectronics. Unlike traditional edge-emitting lasers, VCSEL emits laser light vertically from its chip surface. Thanks to its low power consumption, stable beam quality, low cost, and easy integration, it has become the core light source for 3D sensing, wearable devices, and high-speed optical communication.
As fundamental refractive optical components, plano‑convex spherical lenses consist of one convex spherical surface and one flat surface.
FiDAR, the fiber‑optic radar vehicle positioning and tracking system developed by Jianhe Bafang, is a high‑sensitivity distributed fiber‑sensing solution designed for intelligent traffic road monitoring. It outputs real‑time spatial coordinates of every vehicle across the full road section around‑the‑clock, delivering a brand‑new sensing technology for vehicle‑road cooperation, smart highway construction and urban traffic management.
Raybowlaser, a professional manufacturer of high-power laser chips, has officially launched its upgraded new-generation 1470nm high-performance laser chip. Achieving groundbreaking progress in rated output power and wall-plug efficiency (WPE), this innovative laser chip delivers superior and reliable core light source solutions for medical cosmetology, industrial processing, agricultural applications and scientific research equipment.
Loading...
Name
Phone
Organization
Use Case
Database Platform