High Precision Wafer Alignment Stage N19
It's for the chip. - Wafer Keys (Die-to-Wafer, D2W) Design using scenes , Existing High Precision 、 High Dynamic Performance Response 、 Nano-scale motion control systems that integrate multiple containment devices 。
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Overview
Specifications
| Parameter | Value |
|---|---|
| Axes of motion | X, Y, θZ |
| Sensor Type | Capable Sensors |
| Drive Type | Piezoelectric Ceramic |
| Closed cycle | XY:±50μm θZ:±0.5mrad |
| Minimum Step length | XY: 1nm θZ: 100nrad |
| Repeatability | XY: 5nm θZ: 0.8μrad |
| Linearity | XY: 0.02% θZ: 0.1% |
| Maximum Load | 3 kg |
| Loading a frequency for the vibration @3kg | XY: 120Hz θZ: 180Hz |
| Adjust Time | XY: 80ms θX: 100ms |
| Material | Aluminum Alloy / Titanium Alloy |
| Dimensions | 300x300x50 Medium Φ138 |
| Self Weight | 7.26 kg |
| Operating Temperature | -20~100 ℃ |
| Fit Controller | Digital Servo Controller NPC-031/ Digital Servo Controller NPC-042/ Nano. Servo Controller APS-203 |
Applications
Key Features
Datasheet
Supplier Information
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