Explosion-Proof Glovebox with Large Rectangular Transfer Chamber
The large rectangular chamber provides regular height/width clearance for square molds, battery fixtures, multiwell plates and irregular glassware unsuitable for round sections. Based on a standard1200 single-station glovebox, a right large rectangular airlock and left small airlock combine large-item transfer with efficient small-item transfer. The stated DIICT4 explosion-protection grade supports handling flammable/explosive materials. Main box:1200mm×1000mm×900mm; all Type304 stainless steel,3mm thick,brushed inside and white powder-coated outside. A HEPA-compliant high-efficiency filter uses a0.3μm-pore screen. The tilted clear8mm tempered safety-glass window uses a flange and solid0-type ring vacuum seal for leak-free sealing. Anodized natural-color aluminum glove ports use O-ring seals. The box maintains pressure during operation. Diffuse LED lighting is above each window; two explosion-protected energy-saving lighting systems and one internal power outlet are provided. The right304 stainless rectangular airlock is brushed inside and white powder-coated outside. Its359*600*750mm size admits a19L cylinder specified as φ280 and height680. Double10mm anodized-aluminum doors are provided. The vacuum-display requirement refers to both large/small right-side airlocks,using German WIKA gauges. The small airlock is150mm diameter x300mm long,with manual evacuation/refill valves and displayed vacuum. An explosion-protected,second-level-energy-efficiency vacuum pump has an oil-mist filter and gas-vibration control; manual/PLC starting,reference flow12m3/h and ultimate vacuum≤2x10⁻1pa. It evacuates airlocks and balances box pressure. Detailed pump parameters,drawings and trial-run spares are required. Oxygen analyzer: imported US AVCRAY, selected for the operating environment, not domestically manufactured/assembled, with third-party data assurance; other oxygen analyzer: GE oxy.IQ™ Oxygen Transmitter. Moisture analyzer: imported UK MICHELL, selected for the operating environment, not domestically manufactured/assembled, with third-party data assurance; other moisture analyzer: GE VeriDri™ Dew-Point Transmitter. A quick-change organic-solvent adsorber inside the purifier removes volatile solvents before circulation. It is230mm diameter x410mm high,made from3mm304 stainless,and holds7.3kg activated carbon in series with the main loop. KF40 inlet/outlet and a three-way ball valve support evacuation/refill and cleaning after replacement. Listed certifications: ISO9001, CE and UL. One-year warranty and lifetime repair. Consult the manual's danger, warning and caution provisions.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Boxes - Dimensions | 1200mm×1000mm×900mm |
| Box - Materials | Total stainless steel structure (Type 304) |
| Box - thickness | 3 mm |
| Box - inner surface | The stainless steel lasagna process. |
| Box - Outer surface | Spray, white. |
| Box - Volume | 1.0 m³ |
| Box - Filter | Efficient filters using 0.3 μm aperture filters that meet the HEPA criteria |
| Box - Front Window | Tilt windows, transparent steel-enabled security glass, 8 mm thick; glass windows employ a solid core-0-clip (vacuum seal) French window structure to reach no leak-free |
| Boxes - Gloves | 8 in |
| Boxes - Gloves - Materials | Aluminium alloy, original color oxidation, O-ring seal. |
| Boxes - Gloves - Materials | Butyl rubber gloves. |
| Box - Glove - Thickness | 0.4 mm |
| Boxes - Lighting | LED light, installed above each window, with a wide-reflective feature |
| Boxes - leakage rate | ≤0.001 vol%/h |
| Boxes - Lighting System [Explosive energy efficiency] | 2 lighting systems (explosive energy efficiency) |
| Box-power interface [Inside the box.] | 1 box power interface |
| Transition class -- large transition class -- materials | Large rectangular transition warehouse (304 stainless steel) |
| Transition class -- large transition class -- interior surface | Lasser. |
| Transition class -- large transition class -- outer surface | Spray (white) |
| Transition class -- large transition module -- entry and exit of steel cylinders | Accommodates a19L cylinder ofφ280 and height680 |
| Transition class -- large transition class -- size [Right Side] | 359 mm × 600 mm × 750 mm |
| Transition class -- large transition class -- annex hatch | Double door, aluminium alloy material, anode oxidation treatment |
| Transition class -- large transition class -- attachment door -- thickness | 10 mm |
| Transition class -- small transition module -- materials | stainless steel type 304 (1.4301) |
| Transition class - small transition module - thickness | 2 mm |
| Transition class -- small transition class -- size | 150 mm diameter, 300 mm long |
| Vacuum systems - Vacuum pumps - energy efficiency | Level II |
| Vacuum system - Vacuum pump - reference flow | 12 m3/h |
| Vacuum system - Vacuum pump - limit vacuum | ≤2x10⁻1pa |
| Analyzers - oxygen analysers - dimensions | 205 mm（L） x 80 mm（W） x 60 mm（H） |
| Analyzers - oxygen analysers - range measurement | 0-1000 Ppm |
| Analyzer-water analyser-size | 205 mm（L） x 80 mm（W） x 60 mm（H） |
| Analyzers - hydrometric analysers - range of measurements | 0-500 ppm |
| Change organic solvent absorbent-diameter | 230 mm |
| Change organic solvent adsorptioner-height | 410 mm |
| Change organic solvent adsorptioner-materials | 304 stainless steel |
| Change organic solvent adsorption - thickness | 3 mm |
| Change organic solvent adsorption - Fill | 7.3 kg activated carbon |
| Change organic solvent adsorption - feed and feed. | KF40 |
| Change organic solvent absorber-ball valves. | Three-pass valve. |
| Package Dimensions (W×D×H) | 2500mm×1050mm×2100mm |
| Weight | 500 KG |
Key Features
Datasheet
Supplier Information
Related Products
-
Coated Component
Material-based Production Equipment
Fuzhouzhiyi
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 80T2500
Material-based Production Equipment
Auroralaser
Bending Capacity: 800 kN Bending Length: 2500 mm Distance Between Columns: 2000 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 110T2500
Material-based Production Equipment
Auroralaser
Bending Capacity: 1100 kN Bending Length: 2500 mm Distance Between Columns: 2000 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 110T4100
Material-based Production Equipment
Auroralaser
Bending Capacity: 1100 kN Bending Length: 4100 mm Distance Between Columns: 3500 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Wafer Bonding
Material-based Production Equipment
Jmwafer
晶沐光电 combines wafer grinding/polishing/thinning and laser processing to provide homogeneous/heterogeneous, permanent/temporary wafer bonding. High vacuum sealing, heat/pressure and surface activation create reliable interfaces for3D integration, advanced packaging, MEMS, power, RF and optoelectronic devices, including custom small batches for institutes. Referenced processes/equipment include single-wafer cleaning, class100 cleanroom bonding and KSB-H1000. Permanent bonding irreversibly joins wafers/chips into strong, hermetic, reliable structures. Direct bonding uses ultracleaning, plasma activation and CMP, room-temperature van der Waals prebonding and annealed Si-O-Si covalent bonds: no interlayer, high strength/hermeticity/insulation, void-free/low-stress interfaces for Si/Si, Si/SiO2 and Si/SOI. Anodic bonding uses heat/high electric field for silicon–glass chemical bonds, near-bulk strength, low leak rate and stable sealed cavities, such as Si/borosilicate. Eutectic bonding melts/diffuses Au-Sn, Cu-Sn, In or Au-Si interlayers, yielding low-temperature, conductive, thermally conductive, reliable bonds with broad process windows for Cu/Au/Sn-coated wafers. Thermocompression uses heat/precise pressure for solder-free metal-atom diffusion, high interconnect density/low interface resistance, and direct bonding of Si, metal-coated, compound-semiconductor, sapphire, glass, SiC or ceramic wafers. Hybrid bonding simultaneously joins copper/dielectric for integrated mechanical/electrical submicron-pitch connections, high bandwidth, low latency/loss and HBM/AI stacking in3D NAND, HBM, AI processors, high-end Chiplets and VLSI wafers. Examples are sapphire/Si, SiO2/sapphire and GaAs/Si. Temporary bonding glues a wafer/chip to a carrier for backside processing then gentle release. Thermal-slide bonding softens thermoplastics, PPC or polyimides with heat, hardens on cooling and reheats/slides for release; it resists heat/chemicals for Si thinning, TSV and advanced packaging, but needs heating and may leave adhesive. UV release cures for strength then shortwave UV degrades/debonds UV-release adhesive/double-sided tape: gentle room-temperature release for heat-sensitive MEMS, CIS, compound and ultrathin wafers, but needs a transparent carrier and has moderate heat resistance. Laser release uses transparent carriers and an absorbing layer to decompose/release adhesive without contact; laser-responsive coating plus bonding adhesive gives stress-free, residue-free, precise release for large ultrathin3D IC/HBM/Chiplet/advanced-packaging wafers, at high equipment/material cost. Low-melting In, SnBi or AuSn alloys bond molten and remelt for release; high heat tolerance/conductivity and acid/alkali resistance suit SiC/GaN power devices/high-temperature processes, but metal residue is difficult to clean and processing is complex. Bondable materials include Si, SiC, GaN, sapphire, GaAs, InP, quartz/borosilicate glass, alumina/aluminum-nitride ceramics, diamond, bonded composites, SOI, lithium tantalate/niobate and coated wafers.
Related Articles
VCSEL, short for Vertical Cavity Surface Emitting Laser, is a widely used semiconductor laser component in modern optoelectronics. Unlike traditional edge-emitting lasers, VCSEL emits laser light vertically from its chip surface. Thanks to its low power consumption, stable beam quality, low cost, and easy integration, it has become the core light source for 3D sensing, wearable devices, and high-speed optical communication.
As fundamental refractive optical components, plano‑convex spherical lenses consist of one convex spherical surface and one flat surface.
FiDAR, the fiber‑optic radar vehicle positioning and tracking system developed by Jianhe Bafang, is a high‑sensitivity distributed fiber‑sensing solution designed for intelligent traffic road monitoring. It outputs real‑time spatial coordinates of every vehicle across the full road section around‑the‑clock, delivering a brand‑new sensing technology for vehicle‑road cooperation, smart highway construction and urban traffic management.
Raybowlaser, a professional manufacturer of high-power laser chips, has officially launched its upgraded new-generation 1470nm high-performance laser chip. Achieving groundbreaking progress in rated output power and wall-plug efficiency (WPE), this innovative laser chip delivers superior and reliable core light source solutions for medical cosmetology, industrial processing, agricultural applications and scientific research equipment.
Loading...
Name
Phone
Organization
Use Case
Database Platform